Technology Development Foundry Engineering - Senior Staff Engineer

Job Details:Job Description: As the world's largest chip manufacturer and a global leader in innovation and advanced technology, Intel strives to make every aspect of semiconductor manufacturing state of the art, from process development and manufacturing to yield improvement, packaging, final test, optimization, and world-class supply chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.We are constantly working to create a more connected and intelligent future, and we need your help. Change tomorrow. Start today.What We OfferWe foster a collaborative, supportive, and exciting environment where some of the brightest minds in the world come together to achieve exceptional results. We provide opportunities to transform technology and create a better future by delivering products that impact the lives of people around the globe.What We DoJoin the Logic Technology Development (LTD) organization, a powerhouse of process technology innovation driving Intel's IDM 2.0 strategy and enabling the success of our global foundry customers.We are seeking a versatile Senior Staff Engineer to be at the forefront of Intel's foundry transformation, serving as a pivotal technical partner who guides customers through the entire product development lifecycle. In this role, you will leverage multidisciplinary expertise spanning device engineering, product/process integration, and yield engineering to lead customers from design tape-out and pre-silicon evaluation through testing, validation, silicon qualification, and production ramp.You will also provide critical Far Back End (FBE) expertise in test, bump, and assembly while overseeing wafer manufacturing execution to ensure a seamless transition into High Volume Manufacturing (HVM). This is a unique opportunity to apply broad technical leadership, solve complex challenges, face customers, and actively shape the future of the semiconductor industry.What You Will DoWe are seeking candidates with broad semiconductor expertise across foundry technology development. Depending on experience and business needs, responsibilities may include the following areas:Product/process Integration- Drive end-to-end Multi-Project Wafer (MPW) and New Product Introduction (NPI) execution across the full manufacturing flow, from front-end processing through far backend operations, ensuring quality and on-time delivery.- Serve as the primary customer-facing interface for wafer status, silicon health, technical issues, process changes, and execution alignment.- Own identification and resolution of customer-specific integration challenges.- Drive enablement of customer-specific requirements through effective cross-functional coordination.Device Engineering- Serve as the primary customer interface for device performance, including manufacturing readiness reviews, performance roadmaps and projections, post-silicon characterization, model to hardware correlation, and resolution of customer-specific device issues.- Track device performance targets and process control capability while assessing alignment between silicon results and PDK expectations.- Drive device performance optimization through silicon learning, root-cause analysis, and cross-functional corrective actions to improve product readiness and close performance gaps.Yield Engineering- Serve as the primary yield point of contact throughout the product lifecycle, from design tape-out through High Volume Manufacturing (HVM).- Develop predictive yield models to identify parametric and defect-related loss mechanisms and provide yield projections for test chips, shuttle vehicles, and production products.- Lead deep-dive investigations into yield signals and nonconformances, partnering with Process Integration, Device Engineering, and Defect Metrology teams to eliminate systematic yield losses. Perform root-cause analysis leveraging on state-of-the-art FI/FA.- Establish strong correlations between inline process metrics and end-of-line yield performance to improve process control and production predictability.Cross-Functional Interface and Customer Management- Act as the primary technical liaison and process technology expert between external foundry customers and internal stakeholders across LTD, DTP, CEG, Q and R, APTM, and IFS.- Provide regular, data-driven updates on process development progress, product health, and key technical milestones to senior leadership and customer teams.- Coordinate customer technology deliverables and maintain the product Plan of Record (POR) to ensure alignment with execution plans.- Own and manage cross-functional responses to customer requests and technical challenges related to process technology and manufacturing execution.BenefitsIntel provides benefits that promote a healthy and enjoyable lifestyle, including comprehensive medical coverage, wellness programs, recreational activities, paid time off, employee discounts, and many additional benefits that help make Intel a Great Place to Work.Intel's future-of-work strategy is grounded in the belief that people are our most important asset. We are committed to a hybrid-first approach that provides flexibility while enabling strong collaboration and business success.This position is not eligible for Sponsorship. Qualifications:Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.Minimum Qualifications:- Master's degree with 6+ years of relevant industry experience, or PhD with 4+ years of relevant industry experience.- Degrees in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related engineering or physical science discipline.- 4+ years of experience in at least one of the following areas:Product/Process Integration engineeringDevice engineeringYield engineeringPreferred Qualifications:- Direct experience with Gate-All-Around (GAA) technology nodes.- Foundry customer engagement experience with a demonstrated customer-focused mindset.- Experience supporting or collaborating with fabless semiconductor companies during product development.- Proven ability to influence across organizations and drive execution in highly complex technical environments.- Strong communication, leadership, and stakeholder management skills.Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:US, Arizona, Phoenix, US, California, Folsom, US, California, Santa Clara, US, New Mexico, AlbuquerquePosting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $155,520.00-255,200.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this RoleThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.SummaryLocation: US, Oregon, Hillsboro; US, New Mexico, Albuquerque; US, California, Folsom; US, California, Santa Clara; US, Arizona, PhoenixType: Full time