Senior Engineer, Package Design
$190k - $220kAffinity Executive Search
Job description: Role Summary:We are seeking a Senior Package Design Engineer to join our custom SOC/ASIC development client. Youll work closely with cross-functional teams in the U.S. and overseas on high-performance package substrate design with a focus on signal/power integrity and routing.Key Responsibilities:Perform package substrate design and analysis (SI/PI/routing)Collaborate with layout engineers, marketing, and global design teamsUse tools like HFSS, ADS for package modeling/simulationContribute during pre/post-sales processes Qualifications: Qualifications:BS in EE or related field; MS preferred810 years of experience in semiconductor package designStrong SI/PI analysis, modeling, and simulation skillsExcellent communication, teamwork, and presentation abilitiesPreferred Skills:Expertise in high-speed package/PCB design (SerDes, PCIe, LPDDR, Ethernet)Time/frequency domain analysis, impedance, jitter, eye-diagram, BER analysisExperience with Hspice, Redhawk, electro-thermal simulation, PDN modelingFamiliarity with reliability analysis and packaging/assembly rules Why is This a Great Opportunity: outstanding technology, great opportuity to learn. Growing company with a lot of IP. Everyone contributes.Salary Type : Annual SalarySalary Min : $ 190000Salary Max : $ 220000Currency Type : USDNigel
Vacancy posted 7 hours ago
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Cyfle
San Jose, CA1 day ago
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