Package Development, Signal Integrity and Power Integrity Engineer, Senior Staff
$141.15k - $211.4kMarvell
About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your ImpactGroup DescriptionMarvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, Marvell’s innovative technologies enable new possibilities and power the next generation of performance‑driven systems.Within this ecosystem, Marvell’s central advanced packaging organization plays a critical role in delivering next‑generation connectivity and compute products. The organization brings deep expertise in architecture, package design, and electrical performance, including SI/PI to develop advanced IC packages that support high‑speed interfaces. This work directly shapes product performance, reliability, and time‑to‑market, making it a key contributor to Marvell’s overall technology leadership.What You Can ExpectMarvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects. The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.What We're Looking ForAt least a Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5-10 years of related professional experience OR a Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3-5 years of experience.Strong fundamentals in EM, transmission lines and microwave theoryExperience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence ClarityFrequency domain and time domain knowledge of high speed signalingAbility to automate the SI, PI and Packaging activities using scripting tools like Python.Experience with high-speed electronic packaging for digital and analog ICsPower plane design, modeling and analysis using tools like PowerSI, SIwaveWorking knowledge of circuit design tools: Spectre, ADS, HSpiceUnderstanding, debugging and simulations of EMI/EMC problemsFamiliarity with packaging technologies, materials, package substrate design rules and assembly rulesAbility to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing.Familiarity with IC package layout tools like APD or PADSExperience with 2.5D/3D package development is highly desired.Experience with CPC/CPO connectors is highly desired.Experience with channel simulations using MATLAB or ADS or other tools is a plus.Track record of new product introduction from concept, through development and production is a plus.Knowledge of the thermal and mechanical analysis of the IC package development is a plus.A team playerStrong communication, presentation, and documentation skillsExpected Base Pay Range (USD)141,150 - 211,400, $ per annumThe successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.Additional Compensation and Benefit Elements Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at View email address on click.appcast.io Integrity To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.#LI-MM1SummaryLocation: Santa Clara, CAType: Full time
$192k - $279k
Drive chip-package-system co-design by performing... ...chip floorplan, power tree structure,... ....Develop Power integrity methodology for... ...and Methodology development to enhance accuracy... ...in Electrical Engineering, Computer Engineering... ...in industry Signal integrity and Power...SuggestedWorldwide- ...your career. THE ROLE:As a Signal Integrity Engineer at Adaptive and Embedded Computing... ...teams based on SI and Power simulations and for high-... ...designers, HW architects, IC packaging team, PCB team, and... ...functional teams to drive product development while keeping projects on...Senior
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Design system-level power delivery network solutions... ...silicon, substrate packaging, and printed circuit boards... ...-offs.Perform power integrity design validation,... ...partners to drive the development and evaluation of emerging... ...degree in Electrical Engineering, Computer Engineering,...SeniorWorldwide$197k - $285k
...need to go, and make mobility more efficient and accessible for all. We’re searching for a Senior Staff Signal Integrity Engineer.In this role you willLead Signal Integrity(SI), Power Integrity(PI) implementation in advanced autonomous driving hardware systems, Sensors...SeniorWork at officeLocal area3 days per week$159k - $230k
Support System Signal Integrity (SI) design on data center... ...board, chip and system engineers, design partners, and... ...Circuit (ASIC), package, board, connector, and... ...Experience with the product development process for mass... ...on signal integrity, power integrity and lab validation...SeniorWorldwide$95k - $150k
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.... Today, MEMS timing powers over 400 applications... ...The Principal Hardware Signal Integrity/Power Integrity... ...methodologies that underpin the development of hardware platforms... ...to simulate and engineer complex platforms... ...with circuit design, packaging, board design, and product...- ...diverse perspectives. AMD together we advance_Server Signal Integrity and Power Integrity Lead Engineer Role:AMD has an opening for Signal Integrity/Power... ...and power integrity understanding including silicon, package, and board.Electromagnetic modeling of 3-D structures...
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