Senior Packaging Process Engineer - Substrates & Cu Plating
Applied Materials, Inc.
Applied Materials, Inc. in Santa Clara, CA is seeking an Advanced Packaging Process Engineer III. The successful candidate will work on process development for semiconductor manufacturing technologies, including startup and qualification of new equipment and process optimization. You will be collaborating with R&D teams, utilizing statistical tools to analyze data, and preparing reports summarizing findings. A BS or MS in Chemical Engineering or Material Science is required, along with strong communication and analytical skills. #J-18808-Ljbffr Applied Materials, Inc.
Vacancy posted 1 day ago
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