R&D Engineer

Job Responsibilities

• Technical lead for multi‑chip semiconductor assembly and system pathfinding for leading‑edge artificial intelligence and high‑performance computing modules.
• Owns key portions of the advanced packaging and assembly roadmap, and drives the development of new assembly technology from early R&D through new product introduction by close interaction with technical leads in system customer organizations and collaborating with internal IC design/validation teams and external foundry R&D groups.
• Defines technology requirements and roadmaps, evaluation and qualification plans, and provides hands‑on application support as technology transitions from process R&D to product development.
• Takes a leading role in advanced packaging technology problem solving, providing design and product enablement.
• Serves as the internal principal investigator for new technology projects.
• Capable of independent project management from concept phase through transfer to high‑volume manufacturing, facilitating clear communication with external foundry and assembly collaborators, as well as internal design and validation teams throughout the project.
• Performs risk assessment and helps coordinate cross‑functional technology risk mitigation for multiple projects in parallel.

Key Qualifications

• Broad knowledge of advanced packaging, assembly and silicon process technologies, including thermal solutions, power delivery, and both electrical and optical communication.
• Experience designing serial and parallel interfaces for chip‑to‑chip communication within modules and for external module communication.
• Experience with parametric and yield data analysis.
• Proficiency with statistical data analysis tools.
• Experience with yield failure mechanisms and tools for root‑cause finding (EFA, PFA).
• Experience with thermal and stress simulation tools.
• Exceptional data analysis, problem solving, and interpersonal skills.

Education & Experience

MSEE in Electrical Engineering or a related field required with 15+ years of experience in semiconductor process technology, advanced packaging and manufacturing, specifically R&D and integration roles, or PhD with 12+ years of experience in the same area.

Compensation and Benefits

The annual base salary range for this position is $167,500–$268,000. The role also offers a discretionary annual bonus, competitive equity awards, and a comprehensive benefits package.

• Medical, dental, and vision plans.
• 401(k) participation with company matching.
• Employee Stock Purchase Program (ESPP).
• Employee Assistance Program (EAP).
• Paid holidays, sick leave, and vacation time.
• Paid family leave in accordance with applicable laws.

Equal Opportunity Employer

Broadcom is a proud equal‑opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status, or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.