SI/PI Engineer: 2.5D/3D Packaging for ML ASICs
Annapurna Labs (U.S.) Inc.
Annapurna Labs, an organization within Amazon, seeks a Signal or Power Integrity Engineer to join our hardware team in Austin, TX. You will perform package-level SI/PI analyses for advanced 2.5D/3D-IC packaging and collaborate with die and board teams to optimize performance and reliability. You will build models, run high-speed simulations, and help decisions across IC, package, and board boundaries. Strong EM experience and packaging knowledge are essential for success. #J-18808-Ljbffr Annapurna Labs (U.S.) Inc.
Vacancy posted 2 days ago
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