Masters ASIC Package Eng Intern/Co-op (Hybrid/Onsite)
Advanced Micro Devices Inc
AMD invites driven MS students in Electrical/Computer Engineering to join as ASIC Package Engineering intern/co-op, working with a team of engineers on packaging technology and verification. You will participate in substrate, interposer, and bump design, learn testing, and contribute to cost-efficient materials for performance. This internship is based in San Jose/Santa Clara with full-time hours in hybrid or onsite settings. #J-18808-Ljbffr Advanced Micro Devices, Inc.
Vacancy posted 2 days ago
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Santa Clara, CA1 day ago $45 - $51 per hour
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