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ASIC Package Engineering Intern - Innovate in Packaging

AMD

AMD invites students for Spring/Summer Co-op or Summer Internship roles in San Jose/Santa Clara, CA. You’ll join packaging design teams onsite or hybrid, contributing to design development and testing across AMD products and AI initiatives. You’ll learn substrate/interposer/bump design, perform verification tasks, analyze yields, and collaborate with cross-functional partners to achieve cost-efficient, high-yield packaging solutions. This role runs through 2027. #J-18808-Ljbffr AMD

Vacancy posted 1 day ago
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