Packaging Engineer Intern: Thermal & Substrate Design
$20 - $47 per hourMACOM
MACOM invites an enthusiastic Packaging Engineer Intern to join our team in Milpitas, CA for a 12-week program. You will assist with bump mask design, substrate design, and thermal analyses while working under a senior engineer's guidance. Ideal candidates are pursuing Mechanical or Thermal Engineering, proficient in Autocad/Solidworks, and familiar with FEA tools such as ANSYS, Icepak, or Flotherm. Expected hourly range: $20–$47 per hour, commensurate with experience and location. #J-18808-Ljbffr MACOM
Vacancy posted 4 days ago
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