Integrated Circuit - Packaging Architect Engineer
Advanced Micro Devices Inc
WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. The Role:Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products. Successful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. He/she will be responsible for driving technology development initiatives from concept to qualifications. Successful candidate would lead cross functional teams across geos in designing and developing novel package architectures and processes. He/she will be responsible for executive level communication on technology development progress, driving technical problem solving to address yield, reliability and process development challenges as needed. The candidate will also engage with worldwide ecosystem partners to gather data, analyze and identify solutions.The Person:The candidate should have a proven track record of driving technology development in semiconductor field. He/she should have leadership experience driving engineering teams in architecture definition, process definition and/or yield improvement. The candidate should have excellent oral and written communication skills to share complex signals/recommendations with technology partners, colleagues, product architects and AMD managementResponsibilities:Work with product architects in early definition stage to understand and define package architectures, roadmapLead new package technology development initiatives from concept to full technology qualificationDrive Test vehicle design and manufacturing to establish design rules, DFM/DFY guidelinesEstablish Yield roadmap and lead implementation of yield, data analytic tools as needPreferred Experience:Experience in semiconductor technology development roleExperience working with manufacturing partners such as suppliers, OSATs and foundry partners.In-depth knowledge in material science, thin film process development, and/or packagingExperience in a leadership role driving cross-functional teamsProven track record of driving yield improvement, defect reduction in semiconductor fab or packaging environment Education:BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering or equivalentThis role is not eligible for visa sponsorship.#LI-HYBRID#LI-AP1Benefits offered are described: AMD benefits at a glance.AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.This posting is for an existing vacancy.
- ...advance your career. The Role:Advanced packaging technology leader driving packaging architecture... ...have leadership experience driving engineering teams in architecture definition,... ...technology partners, colleagues, product architects and AMD managementResponsibilities:Work...SuggestedWorldwide
$164.8k - $226.6k
...Summary The Principal Hardware Signal Integrity/Power Integrity Architect is accountable for system-level... ...functional teams to simulate and engineer complex platforms with robust... ...methodologies Collaborate closely with circuit design, packaging, board design, and product teams...Suggested$154.9k - $225.3k
...applications are received.Cisco is seeking a highly capable Advanced Packaging engineer to join Cisco's Packaging Technology & Quality team within... ...technologies—specifically focused on heterogeneous integration—from early-stage conceptualization through qualification....SuggestedFull timeTemporary workLocal areaFlexible hours$161k - $221k
...global leader in materials engineering solutions used to produce virtually... ...team to develop advanced packaging solutions for next-... ...interconnects. As an Advanced Packaging Integration Engineer, you will lead... ...micro-LED panels. You will architect robust, scalable integration...SuggestedFull time$119.62k - $179.2k
...fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your ImpactCelestial AI Systems and Packaging group is hiring a Package Integration Engineer to oversee packaging integration and vendor coordination from design to manufacturing. They'll define day-...SuggestedPermanent employmentFull timeInternshipWork from home$177k - $387k
...data ratesBuild hands‑on channel models across package, board, and systemDrive end‑to‑end SI co‑design... ...equivalent practical experience in Electrical Engineering or related field10+ years of experience in signal integrity or high‑speed interface designStrong hands‑on SI...Full timeLocal areaImmediate start$220.2k - $330.4k
...Technologies, Inc.Job Area:Engineering Group, Engineering Group > Systems... ..., and more.Position: Signal Integrity ArchitectWe are seeking an experienced Signal Integrity Architect (individual contributor) to... ...software, firmware, packaging, product management, and component...Work experience placementWork from home$116k - $189.75k
We are now looking for a Signal & Power Integrity Engineer!NVIDIA has continuously reinvented itself over two decades. Our... ...work in a dynamic cross-functional role to optimize package, PCB, ASIC, mixed signal circuit.What we need to see:BS/MS-Electrical Engineering or...Full time$116k - $189.75k
We are now looking for a Signal & Power Integrity Engineer!NVIDIA has continuously reinvented itself over two decades. Our... ...work in a dynamic cross-functional role to optimize package, PCB, ASIC, mixed signal circuit.What we need to see:MS and/or PhD in Electrical and...Full time$168.4k - $249.31k
..., Your ImpactMarvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute... ...including all signal and power integrity aspects while considering... ...like Python.Working knowledge of circuit design tools: Spectre, ADS, HSpiceExperience...Permanent employmentFull timeInternshipWork from home- ...career. THE ROLE: As a Sr. Signal Integrity/Power Integrity Engineer in our Networking Technology... ...with Silicon IP team, ASIC packaging team, PCB design team, System Architect and external partners/... ...optimizationWork on critical circuits (especially reference clocks...
- ...Jade Global, Inc. is seeking a Senior Integration Architect based in San Jose, California. This role involves leading the architecture and design of integration solutions using Boomi, Workato, and related technologies. A successful candidate will have extensive experience...
$168.4k - $249.31k
...Team, Your ImpactThe Marvell Advanced Packaging R&D team is responsible for package... .... The group focuses on signal integrity, power integrity, thermal integrity,... ...foundries.Deep knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well...Permanent employmentInternshipWork from home- Key Responsibilities Lead architecture and design of enterprise integration solutions using Boomi, Workato, and related integration... ...architecture engagements. Preferred Qualifications Boomi Professional Architect and/or Workato certifications. Experience with AI-driven...
$168k - $264.5k
...highly motivated and self-starting Senior Circuit Design Engineer to join our dynamic and growing team.... ...challenges and benefits of integrated power delivery solutions.Develop prototypes... ...and a comprehensive benefits package. As you plan your future, see what we...Full time$168k - $264.5k
We are now looking for a motivated Senior Circuit Design Engineer to join our dynamic and growing Power Circuits Solutions Group... ...collaborate closely with other System/Software Architects, Power Integrity /Packaging experts and Product and Process engineers to understand...Full time$136k - $218.5k
...Architecture team is hiring a Senior Power Integrity Co-Design Engineer to architect and deliver di/dt mitigation across silicon, package, board, and platform. This role bridges... ...features with Speed, Power, Reliability, Circuit Design , Power-Arch, ASIC, and platform teams...Full timeLive in$117.8k - $200.3k
...solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. The innovative... ...of sales back into R&D. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with...Minimum wageFull timeWork experience placementFlexible hours- ...seeking an experienced SoC Architect to lead the... ...clocking, and platform integration, with a strong focus... ...technologies, advanced packaging, high-speed interface... ...communicate effectively across engineering disciplines and... ..., power management circuits, and other I/O...
$272k - $431.25k
...different die stacking and packaging proposals.Propose and drive... ...to see:BS/MS in Electrical Engineering, Computer Science, Computer... ...of process technologies and circuit design.Well versed in low power... ...is driving innovations that integrate seamlessly with NVIDIA’s broader...Full time$220.92k - $311.89k
...Description: The Role and ImpactAs a Principal Engineer in Analog Circuit Design, you will be at the forefront... ...-power design, and signal and power integrity.- Proficiency in analog behavior... ...offer a total compensation package that ranks among the best in the industry...Full timeLocal areaImmediate startShift work$162.7k - $284.7k
...manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat... ...&D. Our expert teams of physicists, engineers, data scientists and problem-solvers... ...Preferred QualificationsThe Principal HPC Architect designs, builds, optimizes, and...Minimum wageFull timeWork experience placementFlexible hours$142.8k - $274.8k
...Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s... ....We are looking for a Principal SoC Circuit Architect to join the team.ResponsibilitiesSoc... ...definitions partnering with package and System design teamsParticipate in...Ongoing contractPermanent employmentWork at officeLocal areaWorldwide3 days per week$200k
...Overview We are looking for a Principal Packaging Engineer to own package architecture and... ...packaging, package-level signal and power integrity, substrate and assembly technologies,... ...will work alongside experienced leaders, architects, engineers, and operators who have...Full timeFlexible hours$109.94k - $151.17k
...LinkedIn and X.Position OverviewWe seek a highly motivated Senior Packaging Engineer to drive package development and deployment within our New... ...tools a plus.Preferred QualificationsExperience in systems integration and/or NPI systems developmentFamiliarity with assembly...Permanent employmentFull timeFor subcontractorDay shift$136k - $212.75k
...To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through... ...Constraint Manager)Solid understanding of high-speed design signal integrity practicesExperience with Virtuoso and Calibre is a...Full timeRemote work$132k - $158k
Job Title: Sr Packaging EngineerLocation: This position is based in our Campbell, California... ...of products. The Sr Packaging Engineer will collaborate closely with R&D, Quality... ...prototype development Coordinate package integrity, seal strength, transportation, distribution...Full timeContract workWork experience placementLocal area$108k - $172.8k
...apply.Job Description:Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading... ...base stations. You'll have exposure to emerging package integration technologies, such as co-packaged fiber-optic...Full timeLocal areaWorldwide- ...breakthrough technology takes more than great engineering—it takes a team of exceptional people... ...Corporation is seeking a Senior IC Packaging Engineer to provide technical... ...chiplet-based designs, and heterogeneous integration, leading efforts from early technology...
$196k - $310.5k
NVIDIA is now looking for a Senior Power Integrity Engineer to join our LPU Packaging team!NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—...Full timeWork experience placement
Do you want to receive more vacancies?
Subscribe and receive similar vacancies to Integrated Circuit - Packaging Architect Engineer. Be the first to apply!

