ASIC Package Eng Intern: Design & Yield Impact
Advanced Micro Devices Inc
Advanced Micro Devices, Inc. seeks a highly motivated ASIC Package Engineering intern/co-op to join our team and work with engineers at the forefront of packaging technology. You will contribute to bringing new packaging designs to reality and gain hands-on experience on AMD products. You will support substrate/interposer/bump design, verification, and yield analysis, while evaluating materials and collaborating with partners for cost-efficient performance and yield optimization. #J-18808-Ljbffr Advanced Micro Devices, Inc.
Vacancy posted 2 days ago
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