Technology Development Manager / Senior Manager

Job Description onsemi is seeking a highly motivated Technology Development Manager or Senior Manager to lead the development, qualification, and high-volume manufacturing ramp of Embedded Power Module technologies at our East Fishkill, NY 300mm wafer fab. This role is a critical leadership position within the Technology Development organization, with end-to-end accountability for developing onsemi’s advanced Embedded Power Module process and packaging concepts into qualified, manufacturable, and competitive products aligned with onsemi’s long‑term technology and business roadmaps. The successful candidate will lead a team of experienced development engineers and will serve as a key technical and organizational interface across Business Units, Product Engineering, Manufacturing, Operations, Packaging, Reliability, Finance, external partners, and executive leadership. Responsibilities People & Organization Leadership Manage and develop a team of approximately 5–15 engineers. Build a high-performance engineering culture and support talent development and succession planning. Technical & Technology Ownership Serve as overall technical leader for Embedded Power Module technology development, qualification, and ramp. Own technical readiness across process integration, yield, reliability, and manufacturability. Program Execution & Delivery Lead and deliver multiple concurrent technology development programs aligned with global corporate technology development and manufacturing requirements. Partner with program and product management to transition technologies into high-volume production. Cross-Functional & Executive Engagement Act as primary interface with internal stakeholders and external partners. Communicate technical and program status to senior and executive leadership. Qualifications M.S. degree or higher in engineering (Ph.D. preferred). Extensive semiconductor industry experience (typically 15+ years). Strong leadership, communication, and cross-functional collaboration skills. Preferred Deep knowledge of power modules, ICs, advanced packaging, and backend processing. Experience with Cu plate-up, RDL via etch, encapsulation, pick-and-place, sinter attach, and HV testing is desired. Salary Base salary range: $147,000 to $250,000 exclusive of fringe benefits or potential bonuses. Final pay rate depends on geographic location, skills, education, experience, and internal equity considerations. About Us onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end‑markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Equal Opportunity Employer onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws. #J-18808-Ljbffr onsemi