Lead Firmware Engineer - BSP/Platform Engineering

Overview The Technical Lead Firmware Engineer provides deep hands-on technical leadership for embedded firmware development while remaining directly involved in design, implementation, debugging, integration, and release readiness. This role owns technical direction for assigned firmware initiatives, breaks down ambiguous problems into executable plans, raises the engineering quality bar, mentors engineers, and coordinates cross-functional decisions across firmware, hardware, software, QA, DevOps, manufacturing, product, and vendor teams. Responsibilities Drive firmware architecture, technical direction, design decisions, and implementation approach for complex product or platform workstreams. Lead hands-on development, integration, debug, and hardening of embedded firmware features, services, drivers, BSP components, and platform software. Diagnose and resolve complex system-level issues across firmware, hardware, OS, application, networking, AV, manufacturing, and vendor boundaries. Provide technical coaching, design review, code review, debug guidance, and engineering standards that improve team capability and execution quality. Translate product and platform requirements into technical execution plans, milestones, risks, dependencies, and clear ownership across engineers and partner teams. Define validation strategy, release-readiness criteria, regression coverage, and defect-prevention practices for assigned firmware areas. Create architecture records, technical documentation, debug playbooks, root-cause analyses, and stakeholder communications for decisions, risks, and tradeoffs. Qualifications Bachelor's Degree in Computer Science, Electrical Engineering, or related field is required Master's Degree in Computer Science, Electrical Engineering, or related field is preferred Embedded firmware development and debugging using C/C++ across commercial product development lifecycles Technical leadership of firmware features, platforms, or cross-functional workstreams from concept through release Embedded Linux, RTOS, BSP, bootloader, kernel, driver, device-tree/configuration, networking, or low-level platform integration System-level debugging, hardware/software integration, root-cause analysis, production issue resolution, and release hardening Firmware architecture, technical decomposition, design review, implementation planning, and execution leadership C/C++ embedded firmware development, debugging, optimization, and maintainability practices Embedded Linux or RTOS platform knowledge including BSP, bootloader, kernel/user-space interaction, drivers, diagnostics, and device configuration System-level debugging across hardware, firmware, OS, application, networking, AV, manufacturing, and vendor boundaries Technical mentorship, peer coaching, code review, design critique, and engineering standards development Risk identification, dependency management, technical planning, release-readiness assessment, and path-to-green ownership Validation strategy, automation, regression coverage, quality discipline, and root-cause-based defect prevention Cross-functional communication with engineering leaders, product, QA, DevOps, manufacturing, suppliers, and external partners Per applicable state requirements, the annual pay range for this position ($132,000 - $214,000) which consists of base salary (subject to performance), reflects the hiring range for candidates. Also note, an individual’s offer may vary from this range as it may be impacted by additional factors, including but not limited to the candidate's hiring location, qualifications, experience, and market factors. #J-18808-Ljbffr Crestron Electronics