Lead Firmware Engineer - Android/Linux BSP

OverviewProvide technical leadership for the design and implementation of a unified camera BSP infrastructure spanning Linux and Android platforms. This role is responsible for defining BSP architecture, leading camera sensor bring-up and ISP integration, optimizing image quality, and ensuring full compliance with Android Camera HAL requirements. Partnering closely with hardware, imaging, and application teams, this position drives robust, scalable camera solutions from early development through production.ResponsibilitiesOwn the design and implementation of cross-OS camera architecture, leading board bring-up and ensuring robust hardware–software integration across platforms.Own end-to-end development and maintenance of camera drivers (V4L2 sub-devices), ensuring robust integration with the Android Camera HAL.Design and validate DT/DTBO overlays for camera power, reset, and MCLK sequencing, ensuring robust hardware bring-up and runtime stability.Drive image quality tuning for 3A algorithms (AE/AWB/AF), LSC, TNR, and color pipelines using provided tools to achieve optimal performance and consistency.Design and own automated media graph validation, streaming verification, and overnight stress test suites to ensure reliability, performance, and regression coverage.Partner closely with hardware teams to define, validate, and debug CSI timing, PHY configuration, and sensor onboarding during platform bring-up.Own management of NDA-protected components and maintain a structured, reliable communication cadence with silicon and camera vendors.Author and maintain comprehensive technical documentation, bring-up playbooks, and release notes to support platform bring-up, handoff, and long-term maintainability.QualificationsBS/MS in Computer Science or Electrical Engineering is required6 - 8 years of experience in embedded Linux/Android development with strong C/C++ skills.Proven experience with V4L2, Linux kernel camera drivers, and Android Camera HAL. Familiarity with device tree overlays, power sequencing.Hands-on with IQ tuning tools and camera validation frameworks. Experience with ISP pipelines and proprietary HAL components. Ability to debug complex camera pipelines across kernel and user space.Proficiency in Git/Gerrit and build systems for Yocto and AOSP. Knowledge of GStreamer/OpenCV for Linux multimedia pipelines. Experience with Qualcomm’s CHI pipeline.Understanding of Android CTS/GTS compliance and metadata policiesPer applicable state requirements, the annual pay range for this position ($132,000 - $214,000) which consists of base salary (subject to performance), reflects the hiring range for candidates. Also note, an individual’s offer may vary from this range as it may be impacted by additional factors, including but not limited to the candidate's hiring location, qualifications, experience, and market factors.JobFamilyEngineeringJobFunctionFirmware EngineeringPayTypeSalaryEmploymentIndicatorRegular