Staff IC Packaging Engineer - NPI & 2.5D/3D Leader
$154k - $231kQualcomm
Qualcomm is seeking a Staff IC Packaging Engineer to drive the development and commercialization of advanced IC packaging technologies. This role emphasizes innovation and new product introductions, requiring deep expertise in advanced packaging architectures and assembly processes, and involves collaboration with OSAT partners. The ideal candidate will have a Bachelor's degree in Engineering with 4+ years of relevant experience, or a higher degree with less experience. The compensation ranges from $154,000 to $231,000 annually, complemented by a competitive benefits package. #J-18808-Ljbffr Qualcomm
Vacancy posted 3 days ago
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