HBM SoC Physical Design Engineer
$103k - $210kMicron
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. You will also work on efforts to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies.Key ResponsibilitiesOwn physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS, routing, and physical optimization to meet PPA targets.Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs.Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity.Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently.Partner with DFT teams to ensure scan/MBIST requirements are physically realizable and do not compromise PPA or schedule.Work with packaging, assembly, test, probe, and manufacturing collaborators to ensure builds meet manufacturability and quality requirements.Support tape-out execution (checklists, ECO flows, signoff reviews) and contribute to post-silicon debug by correlating silicon behavior with PD/STA/power analysis.Identify flow gaps and improve productivity through scripting/automation and best-practice methodology development.Required QualificationsStrong experience in SoC physical design implementation from netlist to GDSII on advanced nodes and complex designs.Proficiency with industry EDA tools (e.g., Cadence Innovus/Tempus, Synopsys ICC2/PrimeTime, Siemens Calibre or equivalent).Solid understanding of STA fundamentals, clocking, constraints (SDC), and common closure techniques (buffering, path shaping, useful skew, etc.).Experience with power intent and power delivery considerations (e.g., UPF/CPF concepts, power grid planning, power gating implications).Familiarity with physical verification/signoff concepts: DRC, LVS, ERC, parasitic extraction awareness, and signoff handoff quality.Preferred QualificationsExperience with HBM / DRAM adjacent SoC designs, or memory-subsystem-heavy SoCs.Bachelor’s or master’s degree in electrical engineering, Computer Engineering, or a related field.Minimum 3 years of experience in a related field.Proven ability to mentor and develop engineers early in their careers.Good understanding of Agentic AI or willingness to learn Agentic AI to help develop efficient workflow.The US base salary range that Micron Technology estimates it could pay for this full-time position is:$103,000.00 - $210,000.00 a yearAdditional compensation may include benefits, bonuses and equity.Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted onmicron.com/careers/benefits.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.To learn about your right to work click here.To learn more about Micron, please visit micron.com/careersUS Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at View email address on click.appcast.io or View phone number on click.appcast.io (select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.SummaryLocation: Folsom, CA; Richardson, TXType: Full time
$97k - $205k
...communicate and advance faster than ever.As a Physical Verification Engineer, you will be a key technical contributor... ...verification flows for next‑generation HBM logic die and memory‑centric SoCs. You will work across physical design, design rule development, EDA tool teams...SuggestedFull timeLocal areaImmediate start- Micron Technology, Inc in Richardson, Texas is looking for experienced Systems Design Engineers to lead SoC physical design implementations and drive timing closures. Candidates should have strong experience in complex design environments, proficiency with industry-standard...Suggested
$121k - $247k
...communicate and advance faster than ever.As a SoC Design Engineer, you will be part of the Heterogeneous... ..., and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement...SuggestedFull timeLocal areaImmediate startNight shift- Micron Technology is seeking an experienced SoC Design Engineer to join the Heterogeneous Integration Group,... ...development, and integration of next‑generation HBM logic die. You will work with architecture, verification, physical design, firmware, and product teams. The...Suggested
- ...inspiring the world to learn, communicate and advance faster than ever.Micron’s High‑Bandwidth Memory (HBM) Digital Design organization is seeking a Digital Physical Design Engineer to drive backend implementation of high‑performance, low‑power digital logic used in advanced...SuggestedFull timeLocal areaImmediate start
- ...digital architecture and implementation of high-bandwidth memory (HBM) base die in Richardson, Texas. The ideal applicant will have at least 10 years of experience in digital design and System-on-Chip (SoC) integration, along with expertise in SystemVerilog RTL design....
- ...high‑bandwidth memory (HBM) channel support logic,... ...budgets by partnering with physical layer (PHY) and system... ...‑transfer level (RTL) designs in SystemVerilog,... ...cases, and maintain clear engineering change order (ECO) pathways... ...or system‑on‑chip (SoC) integration with ownership...Local area
- ...DEG) is a distributed team of engineers and innovators focused on... ...of memory technology. As an HBM Memory Design Engineer, you will design, analyze... ...and semiconductor device physics. Experience with schematic... ...memory design concepts, and SoC/IO interfaces. Experience...InternshipLocal areaImmediate start
- ...the development of High Bandwidth Memory (HBM) solutions for AI and ML applications.... ...per bit solutions in the industry.As a Design Engineer at Micron Technology, Inc., you will be... ...circuit design and semiconductor device physics.Experience with schematic entry, Verilog...Full timeLocal areaImmediate start
- ...development of High Bandwidth Memory (HBM) solutions for AI and ML applications... ...in the industry.Micron is seeking a Design Infrastructure Engineer to build, enable, and scale characterization... ...-signal circuit development, device physics, and PVT variation.Practical...Full timeLocal areaImmediate start
- ...subsystem, full-chip, and system-level HBM and DRAM designs to ensure functional correctness,... ...global design, architecture, product engineering, and system engineering teams to ensure... ...verification issues in large-scale ASIC, SoC, or memory designs.Excellent analytical...Full timeLocal areaImmediate start
- ...developing High Bandwidth Memory (HBM) solutions for AI and ML... ...memory density and bandwidth. Our designs span custom digital and RTL2... ...Join us as a Senior Verification Engineer and contribute to modular,... ...experts, spanning both IP-level and SoC-level verification. You will...Local areaImmediate start
- ...developing High Bandwidth Memory (HBM) solutions for AI and ML... ...memory density and bandwidth. Our designs span custom digital and RTL2... ...collaborate closely with Design Engineering, Product Engineering, Business... ...architecture, custom and SoC verification methodologies, and...Full timeLocal areaImmediate start
$199k - $347k
...High Bandwidth Memory (HBM) solutions for AI and ML... .... Our modern designs use Through Silicon Via... ...(HBM) system‑on‑chip (SoC) base‑die designs. Your... ...floorplanning, timing, power, and physical design requirements.... ...verification, product engineering, test, probe, and manufacturing...Full timeLocal areaImmediate start$150k - $308k
...communicate and advance faster than ever.HBM Core-Die Architecture & Circuit Design EngineerThis role owns next‑... ..., and long‑term reliability. The engineer will drive architecture definition... ...using transistor‑level simulation and physical implementation analysis Develop...Full timeLocal areaImmediate start- ...communicate and advance faster than ever.Micron’s HIG HBM Digital Design Group is seeking a Digital Design Engineer to contribute to the architecture, RTL... ...You will collaborate closely with verification, physical design, DFT, CAD, and system architecture teams to...Full timeLocal areaImmediate start
- ...than ever.Job DescriptionThe HBM Architecture team develops advanced... ...collaborates closely across design, PHY, ECC, verification,... ...Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related... ...design (memory, SerDes, or SoC datapath).3+ years of hands‑on...Full timeLocal areaImmediate start
$150k - $308k
...advance faster than ever.Job DescriptionWe are the HBM Design Architecture team within Micron’s HBM DRAM Engineering Group. We work at the intersection of design,... ...benchmarking, PPA analysis, Parasitic extraction and physical verificationExperience in driving AI-enabled...Full timeLocal areaImmediate startWorldwide- ...developing High Bandwidth Memory (HBM) solutions for AI and ML... ...memory density and bandwidth. Our designs span custom digital and RTL2... ...experts and collaborate with Design Engineering, Product Engineering, Business... ...architecture, custom and SoC verification methodologies,...
- ## Intern - Memory Design Engineer, HBMRichardson, Texas, United States of AmericaApply NowFind... ...enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory... ...across Design, Verification, Physical Design, Product Engineering, and CAD organizations...InternshipLocal areaImmediate start
- ## Intern - Design Engineer, HIG HBMRichardson, Texas, United States of AmericaApply NowFind out... ...enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory... ...Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering...InternshipLocal areaImmediate start
- ...enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory... ...graphics, and data-center applications. Our engineers collaborate across global teams to... ...Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams...InternshipLocal area
- As a Build Engineer at Micron Technology, Inc., you will be responsible... ...products, collaborating with design and verification teams... ...design and semiconductor device physics. Experience with schematic entry... ...Experience with memory interfaces, HBM architectures, or mixed‑signal...InternshipWorldwide
- ...communicate and advance faster than ever.As a Senior Memory Design Engineer at Micron, you will have the outstanding opportunity to impact... ...layout process including floor-planning, placement, routing, and physical integration.Conduct circuit modeling and simulation using...Full timeLocal areaImmediate start
- ...developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (... ...data-centric systems, collaborating across global engineering and product teams to deliver industry-leading...Full timeLocal areaImmediate start
- ...We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We... ...increasing memory density and bandwidth. Our designs span custom digital and RTL2GDS flows,... .... As a Senior Design Verification Engineer, you will collaborate closely with design...Full timeLocal areaImmediate start
$146k - $297k
...advance faster than ever.As an HBM Power Delivery Network (PDN) Engineer, you will be part of the... ...HIG), responsible for the design, analysis, and... ...with architecture, design, physical design, packaging, and product... ...ResponsibilitiesDesign and develop SoC-level and HBM-cube-level...Full timeLocal areaImmediate start- Req ID: JR87473 Principal Memory Design Engineer, HBM Our vision is to transform how the world uses information to enrich life for all. Micron... ...of device reliability. Expertise in Cadence Virtuoso, physical layout, and circuit floor planning. Experience with FINESIM,...Local areaRelocation
$146k - $297k
Job Description The HBM Architecture team develops advanced datapath... ...collaborates closely across design, PHY, ECC, verification,... ...Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related... ...design (memory, SerDes, or SoC datapath). 3+ years of hands‑on...Full timeLocal areaRelocation- ...than ever.Develop test plans at SOC Level and analyze Coverage.... ...to support issues with current HBM architectures and find opportunities... ...in Electrical and Computer Engineering, or related field and 3 years... ...growth. Micron benefits are designed to help you stay well, provide...Full timeLocal areaImmediate start
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