Foundry Customer NPI Integration Engineer

Overview Join Customer Engineering and play a pivotal role in Intel’s transition from IDM to Foundry. Customer Engineering is an integral part of MDCE (Manufacturing Development and Customer Engineering) responsible for improving yield and performance on high‑volume manufacturing technologies and supporting all Intel customers. Customer Engineering works with our foundry customers to ensure they receive world‑class service. This role seeks a fab integration Customer Engineering professional in the MDCE Customer Engineering organization, primarily owning customer NPI (New Product Introduction) to deliver silicon to customers on time with high quality. The candidate will report to a Customer Engineering manager and work closely with internal teams and external customers to ensure seamless technology integration and customer satisfaction. Position Details Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Responsibilities Own end‑to‑end NPI execution from customer technology enablement and tape‑out support through HVM readiness, performing product‑specific process optimizations to meet foundry customer specifications. Manage NPI schedules, milestones, and deliverables, ensuring on‑time readiness for customer builds and production ramps. Coordinate NPI status updates, technical issue resolution, data reviews, and change communication. Provide regular project status updates and progress reporting to stakeholders. Ensure readiness of process flows, controls, and monitors, including SPC/FDC strategies, inline metrics, test structures, and SORT programs. Own NPI risk assessment and escalation, proactively identifying yield, reliability, and schedule risks and aligning mitigation plans with stakeholders. Support PDK silicon validation and silicon‑to‑model correlation during early product learning. Work with MDCE/Fab Integration, Device, Fab modules, Production, Metrology, and Defect teams to identify the root cause of yield/performance issues and implement mitigation plans within defined timelines to meet committed silicon delivery during early lots and yield/performance targets, and to support fast‑paced yield ramp‑up in high‑volume manufacturing phases. Identify recurring patterns and learnings from customer engagements, abstract them into foundry standards, systemise, automate, and proliferate them across other technologies and customers. Transition products from NPI to sustaining ownership, ensuring robust documentation, handoff, and long‑term manufacturability. Promote foundry best practices for customer engagement, change management, and NPI execution discipline. Professional Traits Excellent written and verbal communication skills to convey complex technical topics to both technical and non‑technical audiences. Problem‑solving technique with strong self‑initiative and self‑learning capabilities. Comfortable working with a high degree of autonomy. Ability to work with multi‑functional, multi‑cultural teams. Highly organized with the ability to identify patterns from customer‑specific issues, abstract key learnings, and systemise and proliferate best practices across teams and technologies. Strong ownership for problems with a high tolerance for ambiguity. Qualifications Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Materials Science, Physics, or a related STEM field; advanced degree preferred. 7+ years in advanced node semiconductor industry in FEOL and/or BEOL Process Integration. 7+ years of experience in semiconductor manufacturing with hands‑on ownership of NPI / technology or product ramp in a foundry or IDM environment. 5+ years of strong background in process integration, device engineering, yield engineering, or manufacturing, including advanced technology nodes. 5+ years of strong project management skills with ability to manage timelines, risks, and deliverables across multiple stakeholders. Preferred Qualifications: Advanced degree (Master’s or Ph.D.) in Electrical Engineering, Physics or Materials Science or a related field. Experience leading cross‑functional teams (FEOL/BEOL, device, yield, defect reduction, manufacturing, test) to resolve complex technical issues. Understanding and collaboration experience with module processes including lithography, dry etch, wet etch, CMP, thin films and metrology. Experience in project/program management and advanced problem solving. Compensation and Benefits Annual salary range: $155,520.00 – $219,550.00 USD, reflecting the minimum and maximum target compensation for the position across all US locations. Work Model: hybrid – employees split time between on‑site at Intel’s Phoenix site and off‑site. Benefits include competitive pay, stock bonuses, and benefit programs that include health, retirement, and vacation. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Additional Information Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. #J-18808-Ljbffr