Principal Physical Design Engineer, STA

Principal Physical Design Engineer, STA — ASIC Products Division (APD)

Location: San Jose, CA

Position Type: Full‑Time

Who We Are — Physical Design Team in APD

Broadcom’s ASIC Products Division (APD) is the global leader in custom high-performance silicon solutions. We partner with the world’s most innovative technology companies—spanning hyper‑scale cloud providers, AI pioneers, and tier‑1 networking infrastructure leaders to co‑design and manufacture complex, custom ASICs that power the modern digital backbone. The Physical Design team within APD is the world‑class execution engine behind the industry's most advanced custom silicon. We push the limits of silicon technology by combining deep architectural expertise, advanced IP, cutting‑edge physical design methodologies in 3nm/2nm nodes, and advanced 2.5D/3D chiplet integration to solve the most demanding compute and bandwidth challenges.We transform ultra‑complex architectures into fully realized, high‑yielding, first‑pass silicon success.

What Defines Our Physical Design Team

Pioneering First‑Pass Silicon in 3nm/2nm: Our team consistently pushes the boundary of physics, taking the largest and most complex die sizes from floorplan to tapeout on leading-edge foundry nodes (N7, N5, N3, and N2).

Record‑Breaking Scale & Complexity:

We regularly execute full-chip physical implementation for ultra‑large‑scale ASICs exceeding tens of billions of transistors, multi‑gigahertz clock frequencies, and dense multi‑die 2.5D/3D integration (CoWoS, HBM3/4, chiplet architectures).

Methodology & Flow Leadership:

We develop and maintain cutting‑edge in-house (AI Driven) automation and methodology across different EDA tools, setting the benchmark for signoff quality and turn‑around‑time (TAT).

About the Role

At Broadcom, we shape the future of global technology by delivering world‑class custom silicon and infrastructure solutions that power the largest hyperscale data centers and advanced AI platforms on earth. The ASIC Products Division is seeking a talented Full‑Chip Static Timing Analysis (STA) Engineer to join our elite engineering team. In this highly visible role, you will be responsible for ensuring that our high-performance, next‑generation ASICs meet their aggressive performance targets and tight timing requirements across all operating conditions. This position is tailored for engineers eager to leverage next‑generation EDA flows, employing AI‑driven automation and machine learning to maximize compute infrastructure efficiency and accelerate timing closure. If you thrive on solving complex timing puzzles at advanced sub‑nodes, managing multi‑mode multi‑corner (MMMC) scenarios at massive scale, and pioneering AI‑assisted methodologies, this is where you belong.

Key Responsibilities

• Full‑Chip Timing Sign‑off & Constraints: Own final timing closure across PVT corners, authoring and maintaining SDC for functional and test modes.
• AI & Infrastructure Optimization: Deploy AI/ML automation within STA flows to minimize execution runtime, maximize shared server/infrastructure efficiency, and implement ML‑based corner reduction while ensuring full physical coverage.
• Triaging & Marginalities: Utilize automated workflows and data‑mining to rapidly triage violations, isolate root causes, and systematically eliminate timing and design marginalities across complex clock networks and multi‑die boundaries.
• Methodology, ECOs & Collaboration: Leverage advanced OCV/SI/IR‑drop concepts, drive timing ECOs, and partner cross‑functionally with RTL, Physical Design, and DFT teams to optimize PPA.

Qualifications

• Education & Experience: Bachelor’s degree in Electrical/Computer Engineering with 12+ years of hands‑on ASIC STA and timing closure experience.
• Technical Expertise: Expert proficiency in sign‑off tools (PrimeTime/Tempus) and advanced MMMC/OCV management.
• Automation & AI: Strong scripting skills (Tcl, Python, Perl, Shell) paired with a proven record of utilizing AI plugins and data‑mining scripts for runtime reduction and reporting.
• Soft Skills: Exceptional problem‑solving and communication abilities.

Compensation and Benefits

The annual base salary range for this position is USD 143,800.00 To USD 230,000.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

• Medical, dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• company paid holidays
• paid sick leave and vacation time

The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom! We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. For more information please visit our video library and check out our Connected by Broadcom series. Follow us on Linked In Broadcom Inc.