Senior SoC Physical Design Engineer: Lead Tapeout & PPA
Micron Technology Inc
Micron Technology in Folsom, California is seeking a SoC Physical Design Engineer to drive advanced HBM SoC implementations from netlist to GDSII. You will collaborate closely with various teams to ensure optimal physical design and successful tapeout execution. The ideal candidate has strong experience in SoC physical design, proficiency with EDA tools like Cadence Innovus, and excellent scripting skills. A degree in Electrical Engineering and a proven tapeout history are preferred. #J-18808-Ljbffr Micron Technology
Vacancy posted 3 days ago
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