Lead Thermo-Mechanical Packaging Engineer, 2.5D AI

DensityAI is seeking a senior packaging mechanical engineer to own thermo-mechanical modeling and FEA for advanced multi-die packages, including 2.5D designs. You will lead the mechanical design of lids, stiffeners, underfills, TIMs, and bondlines, coordinating with OSATs and substrate suppliers to enforce robust signoffs. You will correlate simulations with measurements and drive DOE activities to close gaps between modeling and silicon, while advancing AI-assisted tool flows for faster #J-18808-Ljbffr DensityAI