Senior Photonic Packaging Engineer for 2.5D/3D Interposers
CScale
CScale is building the interconnect for gigawatt-scale AI, focusing on integrated optical interconnect and high-speed packaging. The role centers on driving 2.5D/3D packaging development from concept to production and coordinating with OSATs and foundries to ensure reliability and manufacturability. Ideal candidates will have hands-on experience with high-speed interposer-based packaging, cross-functional communication, and program management to meet tight schedules and complex integration #J-18808-Ljbffr CScale
Vacancy posted 2 days ago
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