Senior Process Engineer (Multiple Positions)

Senior Process Engineer (Multiple Positions), TSMC Arizona Corporation, Phoenix, AZ. Work closely with other innovators in device, integration, defect reduction, lithography, etch and thin films teams to drive leading-edge integrated module development, control, and improvements to resolve issues or specific requests from TSMC’s customers. Lead the design and execution of experiments, interpreting and extracting insightful results from complex data sets to optimize the manufacturing process and achieve precision control at atomic levels. Apply statistics process control methods to establish and sustain a robust manufacturing process. Supervise the installation and maintenance of manufacturing equipment to expand capacity with punctuation and quality. Collaborate effectively with equipment and material suppliers and partners to identify technology gaps and deficiencies; devise, evaluate and qualify mitigation and continuous improvement solutions. 40 hrs/week, Mon-Fri, 8:30 a.m. - 5:30 p.m. MINIMUM REQUIREMENTS: Must have a Bachelor’s degree or foreign equivalent in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science or a related field and 2 years of engineering experience. Alternatively, will accept a Master’s degree or foreign equivalent in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science or a related field. Must have education or experience with semiconductor process engineering. Must have education or experience in at least 2 of the following: Design of Experiment (DOE); statistical process control; or statistical methods for modeling multivariate data sets. Must have education or experience in at least 2 of the following metrology used in semiconductor processing: Transmission Electron Microscopy (TEM); Scanning Electron Microscopy (SEM); Critical Dimension SEM (CD-SEM); Energy Dispersive X-ray Spectroscopy (EDS); Focused Ion Beam (FIB); Atomic Force Microscopy (AFM); X-ray Diffraction (XRD); Emission Spectroscopy; Raman Spectroscopy; Spectroscopic Ellipsometry; Quartz PCI; or Fourier Transform Infrared Spectroscopy (FT-IR). Must have education or experience in at least 3 of the following: wafer cross section techniques; wafer fabrication processes; ion transport phenomena; dynamic random-access memory (DRAM); plasma etching; plasma simulation; semiconductor thin film deposition; Atomic Layer Deposition (ALD); 3D NAND Flash;Chemical Vapor Deposition (CVD); or Plasma Enhanced Chemical Vapor Deposition (PECVD). Please apply at #J-18808-Ljbffr TSMC Arizona Corporation