Module Development Engineer

Job Details Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs path‑finding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost‑sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma‑surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long‑term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as high aspect ratio plasma etch (HARC), atomic layer etch (ALE), EUV patterned layer etch integration, radical and vapor phase isotropic etching, ash and surface treatments, novel patterning or materials‑specific etch solutions. Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field‑level or industry‑recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross‑functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long‑term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Experience working in dry etch in a foundry. Qualifications PhD with 10+ years of directly relevant experience, or Master’s degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor‑related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform‑level solutions. Experience working in dry etch in a foundry. Job Type Experienced Hire – Shift 1 (United States of America) Primary Location US, Oregon, Hillsboro Additional Locations US, Arizona, Phoenix; US, California, Folsom; US, California, Santa Clara; US, Texas, Austin Position of Trust This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended background investigation, which includes (subject to country law) extended education, SEC sanctions, and additional criminal and civil checks. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Annual Salary Range Annual Salary Range for jobs which could be performed in the US: $211,400.00–298,440.00USD. Work Model for this Role This role will require an on‑site presence. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Additional Information Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. #J-18808-Ljbffr