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HBM SoC Physical Design Engineer — Tape-out Ready, Equity

$146k - $309k

Micron Technology, Inc

Micron Technology, Inc is seeking a dedicated HBM SoC Physical Design Engineer in Folsom, California. You will drive advanced SoC logic designs and work alongside various teams to ensure robust implementations from netlist to GDSII. The ideal candidate will possess strong expertise in physical design, proficiency with key EDA tools, and the ability to mentor junior engineers. Competitive full-time salary ranges from $146,000 to $309,000 per year, alongside comprehensive benefits. #J-18808-Ljbffr Micron Technology, Inc

Vacancy posted 17 hours ago
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