Sr. Engineer - CMP/Bond Equipment Development

Job ID and Title JR96830 Sr. Engineer – CMP/Bond Equipment Development Overview Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Responsible for developing and optimizing next generation, first of a kind (FAOK) wafer bond equipment (bond, trim, grind, and others) to improve capability, productivity and cost of such equipment. Work from conception through equipment and sub‑component development to implementation in TD and manufacturing facilities. Identify, diagnose, and resolve equipment related problems by applying failure analysis, FMEA, 8D or FDC/Data Science methodology. Coordinate and carry out equipment evaluation/optimization to implement changes, leading and participating in equipment maturity and availability improvement and cost reduction activities. Interact with various groups, including process development, manufacturing, and equipment vendors, to ensure robust processes that meet the detailed physical requirements for Micron products. Drive wafer bonding technology roadmaps to have a direct influence on Micron’s global leadership in semiconductor manufacturing. Required Education and Experience Employer will accept a Bachelor’s degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics or related field and 2 years of experience in the job offered or in an Engineer‑related occupation. Core Qualifications Semiconductor process or equipment engineering experience. Dielectrics/hybrid bond equipment development with fundamental understanding of bond process and equipment interactions. Designing experiment techniques (DOE), defect analysis, and data analysis. Analytical skills, including JMP Pro 18, Python, and EMA and problem solving skills using model based problem solving methodology. Statistical methods, including SPACE and E3 software. Wafer bonding tools, automation and overlay systems. Job Profile Equipment Engineer 3 Relocation Level: TBD Benefits Micron offers a choice of medical, dental, and vision plans in all locations, benefit programs that help protect your income if you are unable to work due to illness or injury, paid family leave, a robust paid time‑off program, and paid holidays. Please see the Benefits Guide for more details. Equal Opportunity Micron is proud to be an equal opportunity workplace and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr