Principal Engineer - Multi-Physics Sign-off (Timing, PDN & Thermal) (San Jose)

We are seeking a CAD & Methodology Engineer to develop, enable, and support 3DIC and 2.5D physical design and signoff methodologies for advanced multi-die systems. This role focuses on building robust, scalable, and production-ready flows spanning timing, power, IR/EM, ESD, thermal, CFD/FEM, and multiphysics analysis, in close collaboration with physical design, package, PI, reliability, and EDA vendor teams.The ideal candidate brings hands-on understanding of advanced-node implementation and signoff, combined with strong scripting, flow ownership, and cross-team collaboration skills.We are currently hiring across three locations: San Jose, Austin, and San Diego.We are hiring at different levels (Principal, Staff)Responsibilities:This is a hand-on role for delivering tool-flow-methodology and automation.3DIC / 2.5D CAD Flow DevelopmentDevelop, maintain, and qualify CAD flows for 3DIC and 2.5D designs, including chiplets, interposers, and advanced packaging technologiesEnable end-to-end implementation and signoff methodologies covering floor planning through tapeoutSupport die-to-die connectivity, bump/TSV-aware flows, and cross-die constraint managementWork with design and packaging teams to integrate package-aware and system-aware considerations into PD flowsTiming, Power, and Reliability MethodologyDevelop and support STA methodologies for multi-die designs, including cross-die timing, constraints, and closure strategiesEnable power analysis, IR drop, and EM signoff flows for 2.5D and 3DIC systemsDefine guidelines for ESD verification in advanced packaging contextsAssist with tool qualification, correlation, and signoff criteria definitionThermal, CFD, and Multiphysics MethodologyDevelop and support thermal analysis methodologies for 3DIC and 2.5D designsEnable CFD/FEM-based thermal analysis to model conduction, convection, and airflow effects from die to package to systemSupport coupled electro-thermal and Multiphysics flows, integrating power, thermal, and reliability analysisPartner with design and package teams to incorporate thermal considerations early in the design flowAutomation, Infrastructure, and EnablementBuild and maintain automation, scripts, and checks to improve flow robustness, runtime, and usabilityDevelop documentation, examples, and training materials for design teamsDebug flow issues and provide CAD support during active design cyclesDrive continuous improvement based on user feedback and silicon takeawaysTeamwork and Vendor EngagementWork closely with physical design, package, PI, reliability, and silicon teamsCollaborate with EDA vendors to evaluate new tools, features, and roadmap itemsSupport tool upgrades, regressions, and flow migrations across projectsRequired Skills and Experience :VLSI Knowledge MUSTMinimum 5+ years of System Level experience Strong hands-on experience with 3DIC and/or 2.5D designsFamiliarity with chiplet-based designs, system-in-package designs and tradeoffs involved“Nice To Have” Skills and Experience :Experience with TSVs, micro-bumps, interposers, and advanced packaging technologiesFamiliarity with industry-standard EDA tools for 3DIC implementation and signoffCadence Integrity 3D-ICSynopsys 3DIC CompilerCadence Celsius Thermal SolverAnsys IcepakAnsys RHSC-ETOur 10x mindset guides how we engineer, collaborate, and grow. Understand what it means and how to reflect 10x in your work:Salary Range:$262,700-$355,400 per yearWe value people as individuals and our dedication is to reward people competitively and equitably for the work they do and the skills and experience they bring to Arm. Salary is only one component of Arm's offering. The total reward package will be shared with candidates during the recruitment and selection process.Accommodations at ArmAt Arm, we want to build extraordinary teams. If you need an adjustment or an accommodation during the recruitment process, please email View email address on apply.placed-app.com. To note, by sending us the requested information, you consent to its use by Arm to arrange for appropriate accommodations. All accommodation or adjustment requests will be treated with confidentiality, and information concerning these requests will only be disclosed as necessary to provide the accommodation. Although this is not an exhaustive list, examples of support include breaks between interviews, having documents read aloud, or office accessibility. Please email us about anything we can do to accommodate you during the recruitment process.Hybrid Working at ArmArm’s approach to hybrid working is designed to create a working environment that supports both high performance and personal wellbeing. We believe in bringing people together face to face to enable us to work at pace, whilst recognizing the value of flexibility. Within that framework, we empower groups/teams to determine their own hybrid working patterns, depending on the work and the team’s needs. Details of what this means for each role will be shared upon application. In some cases, the flexibility we can offer is limited by local legal, regulatory, tax, or other considerations, and where this is the case, we will collaborate with you to find the best solution. Please talk to us to find out more about what this could look like for you.Equal Opportunities at ArmArm is an equal opportunity employer, committed to providing an environment of mutual respect where equal opportunities are available to all applicants and colleagues. We are a diverse organization of dedicated and innovative individuals, and don’t discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.