Packaging Process Development Engineer

At NovaSensor , an Amphenol company, we are pioneers in high accuracy sensing solutions. As a global leader in MEMS (Microelectromechanical Systems) technology, we design and manufacture advanced pressure sensors that power critical applications across the medical, industrial, and transportation markets—whether it is enabling life-saving medical devices, enhancing vehicle safety and efficiency, or ensuring reliability in industrial systems. We are part of Amphenol, a global leader in advanced interconnect systems, serving diverse markets including automotive, aerospace, industrial, and mobile devices. Amphenol Corporation, a member of the Fortune 500 (NYSE: APH), was established in 1932 and has pioneered innovation in electronics for nearly a century across virtually every end market. Position summary The Packaging Development Engineer will design, develop, qualify, and optimize packaging and assembly processes for semiconductor devices and sensors (including MEMS, ICs, ASICs, discrete sensors). This role leads prototype-to-production process development, reliability qualification, supplier development, and implementation into manufacturing. The engineer will balance electrical/mechanical/thermal performance, cost, manufacturability, and reliability to support Amphenol’s product roadmaps. Key responsibilities Develop and qualify new package types and assembly processes and flows including die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation Define manufacturing process flows, tooling, materials specifications, and control plans for prototypes and high-volume production. Lead Design for Reliability/Manufacturing (DfX/DfM) reviews with product design, test, and manufacturing teams. Create and execute DOE (design of experiments) to optimize process windows and yield; analyze results using statistical tools (e.g., Minitab/JMP). Author and maintain process documentation: process sheets, work instructions, SPC/CPK reports, FMEA, PPAP/APQP packages (for automotive customers). Partner with suppliers and contract manufacturers to qualify equipment, processes, materials (epoxies, solders, plating chemistries), and subcontractor processes; perform supplier audits as needed. Plan and oversee reliability and environmental qualification testing (thermal cycling, HAST, temperature humidity bias, mechanical shock, vibration, solderability, thermal shock); interpret results and drive corrective actions. Perform and coordinate failure analysis (SEM, X-ray/CT, C-SAM, cross-sectioning) and root-cause investigations. Transfer processes to internal and external manufacturing sites where needed; support production ramps and troubleshoot yield/quality issues at manufacturing locations. Ensure compliance with industry standards and customer requirements (JEDEC, IPC, ISO 9001/AS9100/IATF 16949 as applicable), plus RoHS/REACH and other regulatory needs. Mentor junior engineers and technicians; present technical status to stakeholders and customers. Required qualifications BS in Materials/ Electrical/Mechanical Engineering (MS preferred), 3+ years in semiconductor or sensor packaging/process development 2+ years of hands‑on experience in semiconductor or sensor packaging, assembly process development, or failure analysis. Demonstrated experience with die attach, wire bonding, flip‑chip, molding/encapsulation, soldering , singulation and metallization/plating processes. Practical knowledge of reliability test protocols and failure‑analysis techniques. Strong statistical analysis skills and experience with DOE; comfortable using Minitab or JMP. Experience preparing process documentation, FMEA, control plans, and PPAP/APQP packages (especially for automotive/aerospace customers). Excellent written and verbal communication skills; strong cross‑functional collaboration. Preferred experience and skills Familiarity with SEM, X‑ray/CT, C‑SAM, microsectioning, and metallographic microscopy. Knowledge of ESD/cleanroom practices and contamination control. Prior experience working with suppliers across APAC/EMEA and supporting process transfer globally. Technical tools & equipment (examples) Software: Minitab/JMP, Excel, Word, Powerpoint Lab/process tools: wire bonders, flip‑chip bonders, die bonders, reflow ovens, mold presses, plasma cleaning tools, , pick‑and‑place, X‑ray/CT, SEM, C‑SAM, environmental chambers for thermal/humidity testing. Time‑to‑qualify new package/processes (target per product/project). First‑pass yield and overall manufacturing yield improvements. Reliability pass rates vs. customer requirements. Number and criticality of customer field failures attributable to packaging/process development . Successful transfers to internal/external production sites within schedule and budget. Cost‑per‑unit improvements from design/process optimization. Working conditions & travel Typical R&D/lab environment with occasional exposure to cleanroom and manufacturing floor. Global travel to supplier sites, contract manufacturers, and customer locations as needed — typically up to 10–25% Diversity, safety & compliance Follow Amphenol’s EHS and quality policies; contribute to a culture of safety and continuous improvement. Support company diversity and inclusion initiatives.

WHERE YOU WILL WORK

On‑site in Fremont, CA

WHY YOU SHOULD JOIN OUR TEAM

401(k) Health insurance and wellness programs 401(k) with company match Professional onboarding and training opportunities Paid time off Health savings account Flexible spending account Life insurance Inclusive and collaborative work environment Amphenol is an Equal Opportunity Employer #J-18808-Ljbffr Amphenol and its Affiliated Companies