Average salary: $110,838 /yearly

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  • $99.7k - $134.8k

    **Welcome!**.Semiconductor Packaging Engineering PHD Intern page is loaded## Semiconductor Packaging Engineering PHD Internlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todaytime left to apply: End Date: April 27, 2026 (6 days left to apply)job requisition... 
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    Internship
    Local area
    Immediate start
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    Intel Corporation

    Phoenix, AZ
    1 day ago
  • $191.1k - $258.5k

    A leading technology firm is seeking a Senior Package Layout Engineer in Chandler, Arizona. This role involves defining and designing complex package layouts using 2.5D and 3D technologies while collaborating with teams across various locations. Candidates should have an... 
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    Arm Limited

    Chandler, AZ
    2 days ago
  • Intel Corporation is seeking a Packaging Module Process Development Engineer in Phoenix, Arizona. This role involves developing and optimizing packaging processes crucial for future assembly technologies. Candidates should have a relevant degree and significant industry... 
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    Intel Corporation

    Phoenix, AZ
    4 days ago
  • A leading semiconductor company in Phoenix, Arizona, is seeking a Silicon Packaging Engineer. The candidate will drive the development for mask and panel design, ensuring optimal layout and routing. Required qualifications include a Bachelor’s degree in electrical engineering... 
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    Intel

    Phoenix, AZ
    1 day ago
  • $140.83k - $198.82k

    A leading technology company based in Phoenix, Arizona, is seeking a Substrate Supplier Enablement Engineer. The role involves leading supplier development, managing qualification activities, and collaborating with cross-functional teams. Candidates should have a Bachelor... 
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    Intel Corporation

    Phoenix, AZ
    11 hours ago
  • A leading semiconductor company in Phoenix, Arizona, is seeking a Packaging Module Development Engineer to advance semiconductor packaging technology. The role involves mechanical modeling support for R&D and collaboration with engineers. Candidates should have a Ph.D.... 
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    Intel Corporation

    Phoenix, AZ
    11 hours ago
  • A leading semiconductor company in Phoenix, Arizona is seeking a Packaging Module Development Engineer. The role involves providing mechanical modeling support for research and development while working closely with engineers to define problems and deliver solutions in... 
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    Intel Corporation

    Phoenix, AZ
    2 days ago
  • A technology solutions provider is seeking an MECM / Intune Applications Packager to standardize application packaging practices and ensure reliable software deployments across enterprise environments. The role requires a Bachelor’s degree and extensive experience in IT... 
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    Remote job
    Full time

    Inserso Corporation

    Phoenix, AZ
    2 days ago
  • A leading technology company is seeking a Silicon Packaging Design Engineer to join their team in Phoenix, Arizona. This role includes responsibilities for end-to-end development for mask and panel design, implementing physical layout, and conducting design reviews. Ideal... 
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    Intel Corporation

    Phoenix, AZ
    11 hours ago
  • Job Purpose We are seeking a hands‑on Semiconductor Packaging Engineer to work for a High‑Tech Semiconductor Manufacturer in the Tucson area. The Semiconductor Packaging Engineer will ensure stable, robust, repeatable, sustainable and high‑yielding manufacturing processes... 
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    Permanent employment

    Directed Energy Professional Society

    Tucson, AZ
    2 days ago
  • A high-tech semiconductor manufacturer in Tucson seeks a Semiconductor Packaging Engineer to optimize manufacturing processes. Responsibilities include improving workflows, analyzing yield data, and managing engineering teams. This role requires a B.S. or M.S. in Electrical... 
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    Directed Energy Professional Society

    Tucson, AZ
    2 days ago
  • $191.1k - $258.5k

    Arm has a great opportunity for a Senior Package Layout Engineer in our System-in-Package team! This Engineer will be part of a team responsible for implementing ARM’s next generation of SoC’s in the IoT, Automotive, and Compute spaces. These complex designs use current... 
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    Local area

    Arm Limited

    Chandler, AZ
    2 days ago
  • A leading semiconductor company in Phoenix, Arizona seeks a Packaging Module Equipment Development Engineer to advance semiconductor packaging technologies. The role will involve developing innovative assembly solutions and managing project timelines. Minimum qualifications... 
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    Intel Corporation

    Phoenix, AZ
    11 hours ago
  • $191.1k - $258.5k

    A leading semiconductor company in Chandler, Arizona, is looking for a Staff Package Layout Engineer to join their System-in-Package team. The role involves implementing next-generation SoCs in various fields like IoT and Automotive. Candidates should have significant experience... 
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    Flexible hours

    Arm

    Chandler, AZ
    4 days ago
  • $114k - $180k

     ...communications company in Tempe, Arizona is seeking a Mechanical Engineer with extensive experience in satellite thermal analysis. The...  ...involves building thermal models and designing electronics packaging for the space environment. Candidates should have over 8 years... 
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    RigNet

    Tempe, AZ
    2 days ago
  • $153.5k - $242.5k

    A leading communications technology company located in Tempe, Arizona is seeking a Packaging Engineer to manage all aspects of packaging development for RF communication devices. This role requires over 10 years of semiconductor packaging experience, understanding of micro... 

    Viasat

    Tempe, AZ
    4 days ago
  • A leading semiconductor manufacturer is seeking a Silicon Packaging Design Engineer in Phoenix, Arizona. The successful candidate will play a crucial role in the development of innovative packaging technologies, collaborating on design and troubleshooting challenges. They... 
    Full time

    Intel Corporation

    Phoenix, AZ
    11 hours ago
  • A leading semiconductor company based in Phoenix, Arizona is looking for a Silicon Packaging Design Engineer to drive end-to-end development of mask and panel design. Ideal candidates will have a bachelor's degree in electrical engineering and relevant experience in physical... 

    Intel Corporation

    Phoenix, AZ
    11 hours ago
  • Intel Corporation is looking for a Silicon Packaging Design Engineer based in Phoenix, Arizona. This full-time role involves developing innovative substrate designs for high-performance applications and requires a Bachelor's degree in electrical or mechanical engineering... 
    Full time

    Intel Corporation

    Phoenix, AZ
    11 hours ago
  • $91.15k - $172.86k

    **Welcome!**.Silicon Packaging Design Engineer page is loaded## Silicon Packaging Design Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0283156# **Job Details:**## Job Description:The Role and Impact As a Silicon... 
    Local area
    Immediate start
    Shift work

    Intel Corporation

    Phoenix, AZ
    11 hours ago
  • $153.5k - $242.5k

     ...think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team. What you'll do The Packaging Engineer position requires handling all aspects of packaging development. This means planning, crafting, and developing advanced or... 
    For subcontractor
    Work at office

    Viasat

    Tempe, AZ
    4 days ago
  • A leading technology firm is seeking a Silicon Packaging Design Engineer in Phoenix, Arizona. This role involves end-to-end development of substrate designs, collaboration with silicon and hardware teams, and ensuring optimal cost efficiency and manufacturability. Ideal... 

    Intel

    Phoenix, AZ
    11 hours ago
  • $133.8k - $188.89k

    **Welcome!**.Packaging Module Process Development Engineer page is loaded## Packaging Module Process Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0282877# **Job Details:**## Job Description:In this position... 
    Contract work
    Internship
    Local area
    Immediate start
    Shift work

    Intel Corporation

    Phoenix, AZ
    4 days ago
  • A leading semiconductor manufacturer in Tempe is seeking a skilled engineer to design hermetic and radiation-tolerant packaging for aerospace applications. Candidates need a doctorate or master's in engineering and 5-12 years of relevant experience. The role emphasizes... 
    Remote work
    2 days per week

    Renesas Electronics Corporation

    Tempe, AZ
    4 days ago
  • $111.03k - $211.2k

     ...differentiated from other foundries with a combination of leading‑edge packaging and process technology, committed capacity in the US and...  ...standard design packages. The Advanced IC Packaging Software Engineer will work closely with Intel foundry customers on advanced... 
    Work experience placement
    Internship
    Local area
    Immediate start
    Worldwide
    Shift work

    Intel Corporation

    Phoenix, AZ
    11 hours ago
  • Intel Corporation is seeking a Senior Technical Solutions Engineer in Phoenix, AZ. This role focuses on managing customer relationships and driving the adoption of advanced packaging technologies. Candidates should possess a Bachelor's degree in a relevant field and have... 

    Intel Corporation

    Phoenix, AZ
    11 hours ago
  • $164.47k - $232.19k

    # **Welcome!**## .Senior Packaging Process Development Engineer page is loaded## Senior Packaging Process Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0282104# **Job Details:**## Job Description:The... 
    Work experience placement
    Local area
    Immediate start
    Worldwide
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    Intel Corporation

    Phoenix, AZ
    3 days ago
  •  ...hermetic/ceramic/metal and RAD (radiation) tolerant / class P plastic package and interconnect methods for Renesas’s packaging needs in the...  ...and processes within the required schedule from Product Engineer/Program manager. Develop and maintain technical expertise on advances... 
    For subcontractor
    Work at office
    Local area
    Remote work
    Flexible hours
    2 days per week

    Renesas Electronics Corporation

    Tempe, AZ
    4 days ago
  • $155.52k - $255.2k

    # **Welcome!**## .Packaging Module Development Engineer page is loaded## Packaging Module Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Yesterdayjob requisition id: JR0282430# **Job Details:**## Job Description:The Advanced Packaging... 
    Local area
    Immediate start
    Shift work

    Intel Corporation

    Phoenix, AZ
    11 hours ago
  • A leading semiconductor company in Phoenix is seeking an Advanced Packaging Yield Analysis and Defect Engineer. This role requires expertise in data analysis and statistical methods to drive yield improvement across various packaging technologies. Candidates should have... 

    Intel Corporation

    Phoenix, AZ
    2 days ago