Average salary: $110,838 /yearly
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$142k - $214k
...them, combining what they see in the real world, with all that’s available to them in the digital world.We’re looking for a Packaging Process Engineer to join our team at Snap Inc!What You’ll Do:This role will serve as the technical process owner for backend packaging and...SuggestedLive inWork at officeLocal area- Intel Corporation is seeking a Packaging Module Development Engineer in Phoenix, Arizona. This role involves developing innovative packaging solutions for semiconductor technologies and entails strong technical leadership skills and the ability to collaborate across teams...Suggested
- Intel Corporation in Phoenix, AZ, is seeking a Mechanical Design Engineer for semiconductor packaging. This role focuses on designing and developing mechanical components and tooling, collaborating with cross-functional teams, and ensuring design manufacturability. Candidates...SuggestedFull time
- K&K Global Talent Solutions is seeking an experienced Application Packaging Specialist based in Phoenix, AZ. The ideal candidate will have strong hands-on experience with InstallShield and must have skills in packaging, scripting, and troubleshooting. This full-time position...SuggestedFull time
$77.7k - $129.5k
Senior Medical Packaging Engineer Tempe, AZ Join a role focused on developing and improving sterile packaging systems for medical devices. This position contributes to packaging design, validation, and regulatory alignment, supporting both new product development and...Suggested$77.7k - $129.5k
Stryker Group is seeking a Senior Medical Packaging Engineer based in Tempe, AZ, focusing on developing and improving sterile packaging systems for medical devices. This role involves collaborating with cross-functional teams to ensure packaging solutions meet quality,...Suggested- ...Corporation is seeking a proactive and detail-oriented Mechanical Design Engineer in Chandler, Arizona. This role will involve designing and developing mechanical components for semiconductor packaging, collaborating across teams, and addressing design challenges. The...Suggested
- Intel Corporation in Chandler, Arizona is looking for a Module Engineer On Shift. This position requires supporting the manufacturing environment by addressing process and equipment issues during night shifts. The ideal candidate will have a Bachelor's degree in relevant...SuggestedShift workNight shift
$50k - $80k
Tata Consultancy Services Limited is seeking an experienced application packaging professional in Phoenix, Arizona. The successful candidate will be responsible for converting legacy installations into modern packages and ensuring robust installation processes through comprehensive...Suggested$65k - $100k
...Packaging Sales Engineer Job Category: Sales & Marketing Requisition Number: SALES009752 Full-Time Remote Vancouver, WA, USA +5 more locations Do you live on the West Coast? Do you thrive on working closely with customers? Customizing solutions? Closing deals?...SuggestedFull timeRemote work- Intel Corporation is seeking a Packaging Module Equipment Development Engineer in Phoenix, Arizona. This role involves developing and optimizing assembly processes and technologies. Candidates should have a relevant degree and significant industry experience. The ideal...Suggested
- ...Tempe, Arizona is seeking a skilled professional in semiconductor packaging. This role focuses on designing high-performance package... ...and adherence to manufacturing standards. Collaboration across engineering teams is crucial for package optimization and compliance with...Suggested
$115.11k - $219.55k
...innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency... ...engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key...SuggestedContract workWork experience placementLocal areaShift workIntel
Chandler, AZ3 days ago$115.11k - $219.55k
...The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of... ...for high‑volume manufacturing. The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities...SuggestedLocal areaShift workIntel
Phoenix, AZ1 day ago- ...delivering a true turn-key product to our customers. Our scope spans Engineering, prototype builds, through full production, requiring teams... ..., airflow management, heat rejection, and integration of packaged cooling systems into highly constrained modular environments....SuggestedContract workWork at officeLocal area
GTI Fabrication
Phoenix, AZ13 days ago $132.23k - $176.31k
...tier talent ready to take on the challenge. Join us in building the future. The Role SAIC seeks a Lumen Network Design Engineer V (WAN / Work Package Engineer) to support the Department of the Air Force C3BM/ABMS program. In this lead Lumen engineering role, you apply...Contract workTemporary workFor contractorsLumen Inc
Phoenix, AZ4 days ago- A leading technology firm is seeking a Silicon Packaging Design Engineer in Phoenix, Arizona. This role involves end-to-end development of substrate designs, collaboration with silicon and hardware teams, and ensuring optimal cost efficiency and manufacturability. Ideal...
$105.65k - $200.34k
Job Details Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of computing and connectivity. As a key contributor to Intel's cutting...Local areaWorldwideShift work$105.65k - $200.34k
Intel is looking for a Silicon Packaging Design Engineer in Phoenix, Arizona. This role involves designing and implementing silicon interposers and collaborating with various teams to optimize system designs. The ideal candidate should have at least 3 years of experience...- ...ai is seeking a talented individual to join as a Substrate IC Package Designer, focusing on the development of advanced substrate designs... ...role requires a Bachelor’s or Master’s degree in Electrical Engineering and at least 5 years of experience in substrate design. We...Remote job
- Amkor Technology is hiring an IC package Design Engineer for their Tempe, AZ office. The role includes creating high-quality IC package designs and detailed engineering drawings, while driving design optimization and verification. Candidates should hold a relevant bachelor...Work at office
$153.5k - $242.5k
A leading communications technology company located in Tempe, Arizona is seeking a Packaging Engineer to manage all aspects of packaging development for RF communication devices. This role requires over 10 years of semiconductor packaging experience, understanding of micro...- Intel Corporation in Phoenix, Arizona is searching for a Silicon Packaging Engineering Manager. In this role, you will lead a team responsible for delivering advanced packaging solutions while collaborating with cross-functional teams. The ideal candidate brings extensive...Full time
$153.5k - $242.5k
...think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team. What you'll do The Packaging Engineer position requires handling all aspects of packaging development. This means planning, crafting, and developing advanced or...For subcontractorWork at office- Amkor Technology, Inc. is seeking an IC package Design Engineer for its Tempe, AZ office, requiring a bachelor's degree in Electrical or Mechanical Engineering. The role includes designing laminate and wafer level packages, creating engineering drawings, and problem-solving...Work at office
$105.65k - $149.15k
Job Details As a Silicon Packaging Design Engineer, you will play a pivotal role in driving the development of advanced substrate designs, contributing to the creation of cutting-edge technology that fuels Intel's innovation. You will be responsible for the end-to-end development...InternshipLocal areaImmediate startShift work$146.97k - $249.78k
Onsemi is hiring a Semiconductor Packaging Modeling and Simulation Engineer in Scottsdale, AZ. This role involves conducting thermal-mechanical simulations for microelectronic packaging and improving modeling methodologies. Candidates should have a Master's or PhD in relevant...$91.15k - $172.86k
Intel Corporation is hiring a Semiconductor Research Engineer to shape the future of assembly and packaging technologies. This position focuses on innovative research and development, requiring expertise in device physics and semiconductor fabrication processes. Responsibilities...$146.97k - $249.78k
Semiconductor Packaging Modeling and Simulation Engineer Scottsdale, AZ, United States and 1 more Job Description onsemi is seeking a self-driven and motivated professional to join their Corporate R & D modeling and simulation team, located in (Phoenix AZ or San Jose,...Local areaWorldwide- Snap is looking for an experienced engineer to own the backend packaging process for LCOS advanced displays in Chandler, Arizona. You will work closely with cross-functional teams and handle tools for qualification and process improvement. The role requires a BS degree...
