Head of Design & Product Development

The Director, New Product Development will have the ability to evaluate the Datacenter/AI rack market and customers, recognize trends and set forth a plan to penetrate business opportunities/applications that will deploy a liquid cooled interconnect solution for switch and compute applications. This individual will define the customer engagement strategy specific to the Thermal engineering teams and work with the organization to drive revenue and profit growth through customer design wins. Responsibilities will also include the coordination of product support functions targeting customer engagement and qualification requirements (Application engineering, Qual testing, etc.). Additional responsibilities will include business planning and execution driving the product development roadmap as well as operational readiness (supply planning, production capacity, supplier selection and related activities).

Engage customer engineering teams to lead the technical specification development for the liquid cooled cage product including total power, temperature rise, liquid flow rates, mechanical geometry specific to front panel chassis requirements supporting both networking and compute hardware specific to host (switch) to module (NIC card) cabling applications.

Identifies product and application trends/opportunities to drive next gen product roadmaps aligning with Switch and GPU silicon suppliers in addition to the enterprise networking chassis suppliers.

Support application engineering during system bring up/debug (Thermal qualification). On site test set up, troubleshooting and design engineering feedback to address application specific changes.

Establish partnerships with the liquid cooling eco system (Cold plate, QD) suppliers. Acting as a technical lead to establish acceptable performance criteria, tolerance ranges, long term reliability and durability as well as developing an advanced development roadmap to address potential future needs of next generation systems.

Set direction to ensure operational readiness to support customer qualification and production timing requirements.

Bachelor degree in Engineering or related technical discipline (Optics, Electrical and or mechanical engineering)

At least 7 years of thermal component development (High speed communication systems) and program/project management

Experience in cold plate implementations at the Chassis and Rack level for Design and test

Experience developing customer relationships at the leadership level

Business acumen to deliver high level communication in the specified field

This role is eligible for variable pay, issued as a monetary bonus or in another form.

We provide essential resources and support to build and maintain physical, financial, and emotional strength - focusing on overall wellbeing so you can focus on what matters most. Our benefits plan includes medical, dental, vision, flexible spending and health savings accounts, life insurance, ADD, disability, retirement, paid vacation/time off, educational assistance, and may also include infertility assistance, paid parental leave and adoption assistance. Specific eligibility criteria is set by the applicable Summary Plan Description, policy or guideline and benefits may vary by geographic region. Equal Opportunity Employer, including disability and protected veteran status.