Packaging Engineering Tech

Full timeposted on: Posted Todayjob requisition id: R263608Come join Analog Devices (ADI) – a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare. ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. Learn more at and on LinkedIn and X.Job Description SummaryWe are looking for a highly motivated Packaging Engineer who will drive IC package and module development activities for ADI’s new and existing products. Job Description* IC package design: design and optimize IC packages for a wide range of ADI products, using common and advanced analog IC package platforms and assembly/bumping processes.* Power module and system design: design and optimize power modules for performance, manufacturing, and reliability.* Assembly subcontractor/OSAT management: work closely with ADI’s oversea assembly subcontractor/OSATs for new package development and other package-related engineering activities. Late afternoon/early evening conference calls are expected.* Cross functional team collaborations: work closely with internal reliability team, business units, and supply chain management team to provide package engineering support.* Project management: plan and drive package development projects.Minimum Qualifications* Bachelor’s degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, Mechanical Engineering, or Computer Science is required. Internship experience in semiconductor industry is preferred.* Knowledge and experience in selecting IC package bill of material (BOM): solid understanding of mechanical, thermal, and electrical properties of materials, including semiconductors, metals, ceramics, and polymer composites.* Package model and drawing creation: solid skills/experience in CAD tools are desired to create package design models and drawings for package development, simulation, and documentation.* Experienced in Python, machine learning, and image analysis.* Experienced in data analysis.* Package-level and system-level thermal/mechanical/electrical/magnetic simulation skill is a plus.*For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.Department of Commerce - Bureau of Industry and Security and/or the U.As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.**Job Req Type: Graduate JobRequired Travel: Yes, 10% of the timeThe expected wage range for a new hire into this position is $86,480 to $118,910.* Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.* This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.* This position includes medical, vision and dental coverage, 401k, paid vacation, **holidays, and sick time**, and other benefits.

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