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Remote Substrate IC Package Design Engineer (High-Speed)

$130k - $160k

Syenta

Tempe, AZ
  • Remote job

Syenta, based in Tempe, Arizona, seeks a highly skilled professional for substrate IC package design, focusing on advanced multi-layered interposers. The role emphasizes electrical, thermal, and mechanical design collaboration. Candidates should have extensive experience in high-performance processor packaging and utilize tools like Allegro Package Designer. Salary ranges from $130k to $160k, with additional equity and benefits. #J-18808-Ljbffr Syenta

Vacancy posted 2 days ago
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