Principal Wafer Bonding Process Engineer - AI-Driven Yield
Micron Technology
Micron Technology is seeking a Staff/Principal Wafer Bonding Process Engineer in Boise, Idaho to advance next-generation DRAM bonding. You will lead development, plan experiments, and collaborate with cross-functional teams to improve yield, cost, and reliability while applying AI/ML tools to complex problems.
You will contribute to process technology from development to manufacturing, tackling line challenges and qualifying new equipment and materials for high-volume production.
#J-18808-LjbffrVacancy posted 6 hours ago
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