Senior Wafer Bonding Process Engineer - AI-Driven
Micron Technology, Inc
Micron Technology, Inc. in Boise, Idaho is seeking a Staff/Principal Wafer Bond Process Development Engineer to lead development and optimization of wafer bonding technologies for advanced DRAM.
You will plan experiments (DOEs), drive yield improvements, and collaborate across functions to deliver high-quality, cost-efficient solutions. The role emphasizes data-driven decision making and the use of AI/ML/LLM tools to accelerate innovation and maintain production readiness.
#J-18808-LjbffrVacancy posted 9 hours ago
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