Principal Package Design Engineer

Principal Package Design EngineerAt Renesas Electronics, we are a global leader in microcontrollers, analog, power, and SoC products, delivering trusted embedded design innovation that shapes the way we live, work, and connect.As a cornerstone of our Semiconductor Power Product Group, our packaging technology is where cutting-edge silicon meets real-world application. As the industry pivots toward AI/ML hardware, high-performance computing, automotive innovation, and advanced power architectures (including SiC and GaN), semiconductor packaging has evolved from a protective enclosure into a primary driver of system performance. Joining Renesas means you will be at the forefront of this evolution, designing the advanced packaging solutions that empower the next generation of global technology.Job DescriptionWe are seeking a Senior Advanced Packaging Engineer to lead the development and integration of next-generation packaging solutions for high-performance semiconductors and electronic products. This role will focus on advanced package architectures, assembly processes, thermal and mechanical reliability, and cross-functional collaboration with design, manufacturing, suppliers, and quality teams. The ideal candidate has deep expertise in semiconductor packaging technologies and a strong track record of bringing complex products from concept through qualification and high-volume production.ResponsibilitiesLead the design, development, and qualification of advanced semiconductor packaging solutions, including:Flip-chip, Chip EmbeddingWafer-level packaging (WLP/FOWLP)Panel-level packaging (laminate, molding)2.5D/3D packagingSystem-in-package (SiP)Ball grid array (BGA/CSP)Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements.Drive package technology selection and development for new product introductions.Work closely with IC design, substrate, board, thermal, reliability, and manufacturing teams to ensure package compatibility and performance.Oversee package layout reviews, stack-up definition, material selection, and interconnect strategy.Perform and guide simulations and analysis related to:Signal integrity / power integrityThermal performanceMechanical stress / warpageDesign for manufacturability (DFM)Develop assembly flows and process requirements for OSATs and manufacturing partners.Lead package qualification activities, including DOE planning, failure analysis, and reliability testing.Resolve packaging-related issues during NPI prototype builds, qualification, and production ramp.Collaborate with suppliers and internal/external manufacturing partners on process improvements, material evaluation, and yield optimization.Create and maintain package specifications, design rules, process documentation, and technical reports.Mentor junior engineers and provide technical leadership across packaging initiatives.QualificationsRequiredMSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.5+ years of experience in semiconductor packaging or advanced electronics packaging.Strong knowledge of advanced packaging technologies, materials, and assembly processes.Experience with package reliability testing and qualification standards.Deep understanding of thermal, mechanical, and electrical interactions in package design.Experience working with OSATs, substrate vendors, assembly houses, and semiconductor supply chains.Ability to troubleshoot packaging failures and drive root cause/corrective action.Strong project leadership and cross-functional communication skills.PreferredMaster's or PhD in a relevant engineering discipline.Experience with power semiconductor devices and packaging including Si/SiC/GaN MOSFETS, Power Modules, Intelligent Power modules and their applications in consumer and industrial, automotive, performance computing.computing, AI/ML hardware or mobile products.Hands-on experience with tools for package design and simulation such as:Cadence Allegro Package DesignerSolid worksANSYSCOMSOLJMP / MinitabKnowledge of JEDEC standards, IPC standards, and semiconductor qualification methods.Experience in W2W, D2W, D2D 3D heterogeneous integration and chiplet-based packaging.Additional InformationThe base salary range $195,000 - $240,000 represents the good faith estimate of the hourly wage or salary range that the company reasonably expects to pay for this position at the time of hire. Actual compensation decisions are based on a variety of factors, including but not limited to geographic location, relevant experience, skillset, and internal equity.Additional Rewards:Short-Term Incentive (STI): This position is eligible to participate in the company's annual short-term incentive/bonus program, subject to company performance and individual achievements.Long-Term Incentive (LTI): This role is eligible for a new-hire equity grant under the company's long-term incentive guidelines, subject to board approval and standard vesting schedules.Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world?leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.Are you ready to join our team and shape the future with us?Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.