Senior Staff Solution Architect - Teamcenter PLM (Semiconductor)
$144.2k - $216.4kNutanix
Company:Qualcomm IncorporatedJob Area:Information Technology Group, Information Technology Group > IT ArchitectGeneral Summary:The Senior Staff Solution Architect – Teamcenter PLM (Semiconductor) is responsible for designing and governing business‑capability‑driven PLM solutions , using Siemens Teamcenter as the enterprise backbone for semiconductor product lifecycle management.This role is critical in the transformation journey of moving from legacy PLM to Teamcenter (SlCM) and focuses on mapping business capabilities, product lifecycle needs, and governance requirements into scalable, sustainable Teamcenter solution designs . The architect owns current‑state PLM solution architecture and defines a future‑state digital thread roadmap , clearly distinguishing between existing capabilities and forward‑looking architectural options.Infrastructure and environment architecture are supporting considerations; the primary focus is on product capabilities, data models, processes, and lifecycle governance .This role requires full-time onsite work in San Diego, CA (5 days per week).**This position is not eligible for Qualcomm immigration sponsorship.**Minimum Qualifications:7+ years of IT-specific work experience with a Bachelor's degree.OR9+ years of IT-specific work experience without a Bachelor’s degree.Key Responsibilities1. Business Capability–Driven PLM Solution ArchitectureLead solution architecture by translating business capabilities into Teamcenter functional designs , including:Product definition and configurationChange and release governanceLifecycle and revision managementManufacturing readiness and handoffPartner with business stakeholders to ensure PLM solutions reflect how the semiconductor business operates , not generic PLM implementationsEnsure solution designs balance flexibility, governance, scalability, and long‑term sustainability2. Teamcenter Product Capability Mastery (Core Requirement)This role requires deep mastery of Teamcenter’s product capabilities , with the ability to deliberately and correctly apply them to complex semiconductor use cases.Expected capability mastery includes, but is not limited to:Product Structure & BOM ManagementItem and Item Revision modelingMulti‑view BOMs (design, manufacturing, test, system)Variant and effectivity strategiesLong‑lifecycle and derivative product structuresLifecycle & Configuration ManagementLifecycle state designRevision and release strategiesGovernance patterns for long‑running semiconductor productsChange ManagementChange objects, workflows, and impact analysisMultiple change processes aligned to lifecycle statesAuditability and traceability for high‑impact changesWorkflow & Process OrchestrationBusiness‑driven workflow modelingAlignment of workflow automation to decision ownershipAvoidance of over‑customizationClassification, Metadata & Information ModelingAttribute strategies supporting reuse, reporting, and analyticsData standardization across products and generationsSecurity & Access Control (Business Perspective)Role‑based access aligned to functional responsibilitiesProtection of sensitive product and roadmap informationThe architect is expected to act as a Teamcenter product authority , able to explain and defend why specific platform capabilities are used—or consciously not used—for each business need.3. Semiconductor Product Lifecycle EnablementArchitect PLM solutions that support semiconductor‑specific realities, including:Silicon and derivative product hierarchiesLong product lifecycles with high change velocityComplex product structures across silicon, package, test, and system viewsSustaining engineering, errata, and lifecycle traceabilityEnsure Teamcenter remains the authoritative system for product structure and change governance .4. Change, Configuration & Governance ArchitectureDefine solution patterns for multiple change processes aligned to lifecycle statesArchitect governance for:Pre‑release vs post‑release changesHigh‑impact and high‑risk semiconductor changesEnsure workflows and data models support auditability, traceability, and downstream impact analysis5. Digital Thread Roadmap & System‑of‑Systems DesignDefine and evolve a business‑driven digital thread roadmap spanning:Product definitionManufacturing readinessQuality and lifecycle feedbackIdentify and document future‑state architectural opportunities to improve traceability and system alignmentEvaluate potential future PLM touchpoints with:Design‑side systems (e.g., ECAD, MCAD, design metadata)Manufacturing and test systemsQuality, reliability, and analytics platformsThis role focuses on architectural readiness and roadmap definition , without assuming current‑state integrations.6. ECAD / MCAD & Cross‑Discipline AlignmentEnsure PLM solution designs support effective coexistence with:ECAD systemsMCAD systemsOther engineering authoring toolsArchitect data models, governance, and metadata strategies that enable:Cross‑discipline alignmentConfiguration consistencySystem‑of‑systems scalability without tool lock‑in7. Closed‑Loop Quality EnablementArchitect PLM solutions that support closed‑loop quality capabilities , including:Linking quality events to product structures and changesTraceability for failures and corrective actionsEnsure PLM designs support root cause analysis and lifecycle learning, even when execution occurs in downstream systems8. Integration Strategy (Business‑First)Define capability‑level integration requirements between Teamcenter and:ERP systemsManufacturing and test systemsAnalytics and reporting platformsEstablish clear system boundaries, data ownership, and governance principlesPrevent point‑to‑point solutions that undermine lifecycle integrity9. Vendor & SI Architectural LeadershipAct as solution architecture authority for system integrators and vendorsReview and challenge solution designs that:Misuse Teamcenter capabilitiesIntroduce unnecessary customizationCompromise upgradeability or lifecycle governanceEnsure PLM architecture remains enterprise‑owned , sustainable, and future‑ready10. Infrastructure & Environment Considerations (Nice to Have)Collaborate with platform and infrastructure teams to ensure:Solution designs are deployable and operableNon‑functional requirements are understoodProvide guidance on environment strategy, performance expectations, and availability as neededExperience RequirementsOverall Experience10–15+ years of experience in IT, engineering systems, or enterprise solution designPLM Experience10–15+ years in PLM solution architecture and delivery6–10+ years of Siemens Teamcenter experience in architect or lead rolesProven ability to map business processes and capabilities to Teamcenter designsSemiconductor / High‑Tech Experience8–12+ years supporting semiconductor and complex hardware product lifecyclesStrong understanding of design‑heavy, change‑intensive environmentsEducationRequiredBachelor’s degree in Engineering, Computer Science, Information Systems, or equivalentPreferredMaster’s degree in Engineering, Computer Science, Systems Engineering, or Engineering ManagementProfessional ExpectationsStrong business‑to‑technology translation skillsAbility to influence without direct authorityComfortable operating in ambiguity and future‑state planningEnterprise‑first, long‑term architectural mindsetExcellent executive‑level communication and documentation skillsQualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail View email address on click.appcast.io or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.Pay range and Other Compensation & Benefits :$144,200.00 - $216,400.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link .If you would like more information about this role, please contact Qualcomm Careers . #J-18808-Ljbffr
$144.2k - $216.4k
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