Senior IC Packaging Engineer: Power Chiplets & 2.5D/3D
$175k - $225kPowerlattice Technologies Inc.
Powerlattice Technologies Inc. is seeking a technical leader in Chandler, AZ, for developing pioneering semiconductor packaging solutions. This role requires defining architecture and driving the end-to-end development of novel IC packaging integrating power delivery chiplets. Candidates should have over 8 years of experience in semiconductor packaging and advanced packaging technologies. A competitive salary of $175,000 - $225,000 is offered, alongside benefits including stock options and health coverage. #J-18808-Ljbffr Powerlattice Technologies Inc.
Vacancy posted 1 day ago
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