IC Packaging Design Engineer

Employment: Long-Term Contract (12+ Months) Experience: 4 6 Years Role Overview We are seeking an IC Packaging Design Engineer with experience in advanced semiconductor package design and substrate layout. The role involves package implementation using Siemens Xpedition or Cadence APD while ensuring signal integrity, power integrity, manufacturability, and design rule compliance. The engineer will work closely with cross-functional hardware, package, SI/PI, and manufacturing teams throughout the package design lifecycle. Key Responsibilities Develop IC package layouts for advanced semiconductor devices. Implement package physical design following engineering specifications. Collaborate with SI/PI teams during package implementation. Perform substrate routing, fanout planning, and escape routing. Ensure compliance with package design rules and manufacturing requirements. Support design reviews and engineering change implementation. Coordinate with hardware, PCB, and package engineers. Optimize package layout for electrical and mechanical performance. Support package release documentation. Participate in design verification and issue resolution. Contribute to yield and reliability improvements. Required Qualifications Bachelor's or Master's degree in Electrical or Electronics Engineering. 4 6 years of experience in IC Packaging Design. Experience in advanced semiconductor package layout. Strong understanding of substrate design methodologies. Experience working in cross-functional semiconductor teams. #J-18808-Ljbffr Best NanoTech