Senior Package Architect: Advanced Packaging & System Exploration
$177k - $387kMicron Technology
Micron Technology is seeking an experienced professional for a role focused on advanced package architectures and package-level simulation in San Jose, California. The ideal candidate will possess at least a Bachelor’s degree and 10+ years of experience in package design. Responsibilities include defining package architectures, running thermal simulations, and guiding architectural requirements. The position offers a competitive salary range from $177,000 to $387,000 annually. #J-18808-Ljbffr Micron Technology
Vacancy posted 2 days ago
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