Key Account Sales Manager

Company Description Plasmatreat is an international leader in atmospheric pressure plasma systems used for pretreating substrate surfaces such as plastic, metal, glass, and paper. Its Openair-Plasma® technology enables reliable bonding, painting, printing, and gasketing in automated, continuous manufacturing environments. The company serves diverse industries, including automotive, electronics, transportation, packaging, consumer goods, textiles, medical technology, and renewable energy. Plasmatreat operates technology centers in Germany, the USA, Canada, China, and Japan, and maintains a global sales and service network in more than 30 countries. Applicants join a technologically advanced, globally active organization focused on innovation and sustainable industrial solutions.

Position Summary:

The Senior Key Account Manager is responsible for developing and managing strategic customer relationships within the semiconductor advanced packaging market. This role serves as the primary interface between customers and the company, driving business growth through the adoption of innovative solutions supporting advanced packaging applications.

The ideal candidate will possess a strong understanding of semiconductor manufacturing and advanced packaging technologies, including 2.5D/3D integration, fan-out packaging, System-in-Package (SiP), wafer-level packaging, chiplet architectures, hybrid bonding, and heterogeneous integration. The position requires close collaboration with customer engineering, manufacturing, operations, and executive teams to identify opportunities, solve technical challenges, and support long-term technology roadmaps.

The goal is to increase revenue, expand market share, and establish trusted partnerships with leading semiconductor companies, OSATs, IDMs, foundries, and advanced packaging ecosystem partners.

Key Responsibilities:

Strategic Account Leadership

• Serve as the primary business and technical liaison between strategic semiconductor customers and the company's regional and global organizations.
• Develop executive-level and working-level relationships across customer organizations, including Packaging Engineering, Process Development, Manufacturing, Operations, Procurement, Supply Chain, and Executive Management.
• Drive long-term account growth strategies aligned with customer technology roadmaps and advanced packaging initiatives.
• Establish trusted advisor status by understanding customer business objectives, manufacturing challenges, and future technology requirements.

Advanced Packaging Business Development

• Develop deep technical knowledge of the company's products, process technologies, and value propositions related to semiconductor assembly and packaging applications.
• Identify and develop new business opportunities within advanced packaging segments, including:
• Fan-Out Wafer-Level Packaging (FOWLP)
• Fan-In Wafer-Level Packaging (FIWLP)
• 2.5D and 3D Packaging
• Chiplet Integration
• Heterogeneous Integration
• System-in-Package (SiP)
• Hybrid Bonding
• Through-Silicon Via (TSV) Technologies
• Advanced Substrate and Interposer Applications
• Collaborate with product management, applications engineering, and R&D teams to develop and commercialize next-generation solutions addressing emerging packaging requirements.

Customer Engagement & Program Management

• Lead customer-facing engagements from technology evaluation through high-volume manufacturing adoption.
• Support process qualification, proof-of-concept activities, pilot programs, and production ramp initiatives.
• Coordinate cross-functional teams including engineering, operations, quality, service, and product development to ensure successful project execution.
• Monitor customer satisfaction and proactively address issues impacting delivery, quality, performance, or support.
• Market Intelligence & Technology Leadership
• Track semiconductor packaging industry trends, technology roadmaps, and competitive activities.
• Assess customer needs and provide market feedback to influence product strategy and innovation priorities.
• Participate in industry conferences, technical forums, and customer workshops to enhance market visibility and establish thought leadership.
• Maintain awareness of advanced packaging developments from leading IDMs, foundries, OSATs, and semiconductor equipment manufacturers.

Sales & Commercial Management

• Develop and execute account plans to achieve revenue, profitability, and strategic growth objectives.
• Manage forecasts, sales opportunities, customer activities, and account information within CRM systems.
• Negotiate commercial agreements, including NDAs, development agreements, purchase contracts, and service/support agreements in accordance with company policies.
• Drive capital equipment sales, process solution adoption, and long-term partnership agreements.

Required Qualifications:

• Bachelor's degree in Engineering, Materials Science, Physics, Semiconductor Technology, Business, or related technical discipline; MBA preferred.
• 5-10+ years of experience in semiconductor manufacturing, advanced packaging, semiconductor equipment, materials, or related technology industries.
• Proven experience managing strategic semiconductor accounts and driving business growth within major semiconductor manufacturers, foundries, or OSATs.
• Strong understanding of semiconductor assembly, packaging, and manufacturing processes.
• Demonstrated knowledge of advanced packaging technologies, including wafer-level packaging, fan-out packaging, SiP, chiplets, heterogeneous integration, or hybrid bonding.
• Experience selling capital equipment, process technologies, materials, or manufacturing solutions into semiconductor fabrication or packaging environments.
• Excellent communication, presentation, negotiation, and relationship-building skills.
• Ability to engage effectively with technical, operational, and executive stakeholders.
• Strong problem-solving and project management capabilities.
• Experience working in global organizations and multicultural business environments.
• Proficiency with CRM systems (Salesforce preferred) and Microsoft Office applications.

Preferred Qualifications:

• Existing relationships with leading semiconductor companies, including IDMs, foundries, OSATs, or advanced packaging suppliers.
• Experience supporting customers such as Intel, TSMC, Samsung, ASE, Amkor, SK Hynix, Micron, Broadcom, NVIDIA, AMD, Qualcomm, or similar industry leaders.
• Knowledge of semiconductor packaging reliability, yield improvement, process integration, and manufacturing scale-up.
• Familiarity with semiconductor capital equipment procurement cycles and technology qualification processes.

Working Conditions:

• Office-based or remote/home-office location with strong self-management and organizational skills.
• Flexible schedule to support customers and global teams across multiple time zones.
• Frequent domestic and international travel to semiconductor manufacturing facilities, advanced packaging sites, corporate headquarters, and industry events.
• Ability to support product demonstrations, technology evaluations, and customer process development activities in laboratory and production environments.
• Ability to lift and install equipment components weighing up to 50 lbs when supporting customer demonstrations or evaluations.