Packaging Substrate Engineer
Apple Inc.
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple’s internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation package structure and configuration optimization. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package performance. Description Lead SoC package substrate technology development, pathfinding, and roadmap definition. Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM. Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions. 5% International travel Responsibilities Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging roadmap. Work with cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability etc. Problem solving of technical issues during the full product development cycle. Minimum Qualifications Minimum requirement of a bachelors degree Preferred Qualifications MS and or Ph.D. and 3+ years of relevant industry experience. In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap. Hands‑on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish etc. Familiarity with package assembly and integration process preferred. Experience in Cadence Allegro platform tools and design review for manufacturing (DFM). Exceptional technology development & project management skills. Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant. #J-18808-Ljbffr Apple Inc.
- ...individual in Austin, Texas, to lead the development of SoC package substrate technologies for its hardware technology team. This role involves... .... Candidates should have a solid academic background in engineering, preferably with an MS or Ph.D., and hands-on experience in...Suggested
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- ...result? We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will... ...collaboration with quality, reliability, and FA teams. Partner with substrate and package design teams to provide DFM input on pad/bump...SuggestedOverseas
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- ...seeking an experienced professional for a role in semiconductor packaging involving multiphysics simulations and interconnect modeling.... ...with EDA tools. This role involves collaboration with engineering teams and vendors to develop and refine simulation workflows....
- Apple Inc. in Austin, Texas is seeking a passionate expert for packaging design. Join a diverse team helping to enhance customer... ...and manufacturing processes. If you possess a BS in Mechanical Engineering or related fields, along with 3+ years of relevant experience,...
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- ...leading technology company based in Austin, Texas is seeking a packaging design professional to create innovative and sustainable... ...environmental standards. Candidates should have a BS degree in Mechanical Engineering or Packaging Science, along with 3 years of relevant...
- ...attention for details and love for excellence to work towards an extraordinary result?We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM simulation with multi-year FEM software ANSYS or ABAQUS.This position requires someone familiar...
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- ...Own and execute hands-on semiconductor package mechanical and thermal simulations for advanced... ...stress across chiplets and advanced substrates.* Build and validate comprehensive ADK/... ...strategy for SI/PI flows, mentor junior engineers, and represent TIE in working groups,...Local areaFlexible hours
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...looking for a Signal & Power Integrity Engineer! Responsibilities Work on crafting creative... ...or modelling tool/methodology updates. Substrate and board layout SI guidelines creation,... ...cross-functional role to optimize package, PCB, ASIC, mixed signal circuit. What...$116k - $189.75k
...looking for a Signal & Power Integrity Engineer! NVIDIA has continuously reinvented itself... .../or modelling tool/methodology updates. Substrate and board layout SI guidelines creation,... ...cross‑functional role to optimize package, PCB, ASIC, mixed signal circuit. What we...- Apple Inc. is seeking a Silicon Photonics & Optical Packaging Engineer in Austin, Texas, to develop optical I/O module architecture and assembly solutions. The role includes designing silicon photonic devices to optimize coupling and performance, working with cross-functional...
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...High-speed IC Package Development Engineer Marvell's Central Engineering team is seeking a talented high-speed IC package development engineer... ...with packaging technologies, materials, package substrate design rules and assembly rules Understanding, debugging...Permanent employmentInternshipWork from home- CMTA, Inc. is seeking a Mechanical Engineer in Austin, TX, with 5+ years of experience in consulting engineering. In this role, you will design energy-efficient mechanical systems and manage projects from conception to completion. The ideal candidate should possess a Bachelor...Flexible hours
- ...: Principal Signal Power Integrity Engineer, Texas Institute for Electronics ----... ...building foundational capabilities in advanced packaging and integrated design infrastructure to... ...-bumps, hybrid bonds, RDL, and advanced substrates (silicon, glass, organic). Architect...For contractorsMonday to FridayFlexible hoursShift workNight shift
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- ...schematic, layout, PCB Stack-up reviews, component placement, substrate layout reviews and chassis, rack, connectivity design. Work with... ...as python is a plus ACADEMIC CREDENTIALS BS in Electrical Engineering or equivalent MS or a PhD in Electrical Engineering LOCATION...Worldwide
$100k - $115k
...Job Description Job Description Mechanical Test Engineer (Automation Tooling & Test Systems) Location: Austin, TX (100% onsite) Compensation: $100,000 - $115,000/year base salary + 10% annual bonus Relocation Assistance: Available for qualified candidates...Relocation package$70k - $90k
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