Packaging Module Development Engineer
$115.11k - $219.55kArizona Staffing
Advanced Packaging Technology Manufacturing EngineerThe Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.As a Packaging Module Development Engineer, you will:Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms.Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilitiesLead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing.Manage projects to ensure alignment with product development schedules and execution milestones.Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges.Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environmentsRespond effectively and with urgency to foundry customer requests, escalations, and manufacturing eventsThe ideal candidate should demonstrate:Technical leadership, strategic planning, and critical thinking.Ability to coach and develop technical teams.Tolerance for ambiguity and adaptability in a dynamic environment.Flexibility in managing changing priorities and responsibilities.Experience leading teams in a highly matrixed organization.Initiative and ability to work independently.Strong communication, influencing, technical, and analytical skills.This position requires regular onsite presence.Qualifications:You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.Minimum Qualifications:- Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.- Experience listed above should be a combination of the following:Programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts.Preferred Qualifications:One or more years of experience in one or more of the following areas:- Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)- Delivery of results for complex, time-critical technical projects.- Semiconductor fabrication processes and technologies.- Prior related work experience within a semiconductor foundry.Job Type: Experienced HireShift: Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers — from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
$115.11k - $219.55k
...Details:Job Description: The Advanced Packaging Technology Manufacturing (APTM)... ...division at Intel is responsible for the development and commercialization of industry-... ...volume manufacturing.As a Packaging Module Development Engineer, you will:• Contribute to the advancement...SuggestedFull timeWork experience placementInternshipLocal areaImmediate startShift work$99.03k - $188.89k
...and do something wonderful.The Role and ImpactJoin Intel's Packaging Module Development team and play a pivotal role in pioneering assembly... ...'s future advancements. As a Packaging Module Development Engineer, you will develop innovative processes and refine equipment...SuggestedFull timeInternshipLocal areaImmediate startShift work$133.8k - $188.89k
...Details:Job Description: The Advanced Packaging Technology and Manufacturing (APTM) organization... ...is seeking a Metrology Equipment Engineer to drive process control, manufacturing... ...with equipment suppliers, internal development teams, quality, process, and manufacturing...SuggestedFull timeLocal areaImmediate startShift work$115.11k - $219.55k
...presence to fulfill essential job responsibilities.As an RF Module Development Engineer, you will be at the forefront of driving innovation and... ...customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our...SuggestedFull timeInternshipLocal areaImmediate startShift work$115.11k - $219.55k
Intel is seeking an RF Module Development Engineer based in Phoenix, Arizona. In this role, you will drive innovation in analog RF test and design... ...use of advanced lab equipment. A competitive compensation package includes an annual salary range of $115,110 - $219,550,...Suggested$133.8k - $188.89k
Job Details:Job Description: Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and material development to scale advanced substrate...Full timeInternshipLocal areaImmediate startShift work- Intel is seeking a Packaging Module Development Engineer in Laser Assembly based in Phoenix, AZ. You will design laser-assisted packaging processes, optimize performance, and collaborate across teams to advance next-generation semiconductor packaging. The role emphasizes...
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- Talanto in the United States (Arizona, Phoenix) is seeking a Packaging Module Development Engineer in Laser Assembly to advance semiconductor packaging technologies. You will help develop laser packaging processes and equipment, impacting performance and reliability of...
$128.88k - $245.16k
...highly skilled team driving the development of cutting-edge technologies. As an EDA Tools Software Engineer, you will design, develop,... ...including DRC, and density/fill modules. Industry experience with... ...semiconductor foundries, advanced packaging organizations (OSATs),...Full timeLocal areaImmediate startShift work$115.11k - $188.89k
...Details:Job Description: The Role and ImpactJoin Intel's Packaging Module Development team and play a critical role in shaping the future of assembly... ...packaging technologies. As a Packaging Module Development Engineer, you will design and optimize innovative processes and...Full timeInternshipLocal areaImmediate startShift work$76.39k - $146.44k
...Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate... ...elements of module-level process development in support of the factory's goal and output... ...ABenefitsWe offer a total compensation package that ranks among the best in the industry...Full timeInternshipStart working todayLocal areaImmediate startShift workNight shiftDay shift$99.03k - $139.81k
...Details:Job Description: Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management, package design/... ...able to coach and role model the correct execution of module operations.Clearly understand and communicate execution...Full timeLocal areaImmediate startShift work$89.01k - $170.63k
...in inline metrology will give engineers more data throughout the... ...Technology Fabrication (OTF) Module Engineer role is multifaceted... ...elements of module-level process development in support of the factory's goal... ...offer a total compensation package that ranks among the best in...Full timeWork experience placementInternshipLocal areaImmediate startFlexible hoursShift workNight shiftDay shift$85.2k - $162.5k
Job Details:Job Description: The Role and ImpactJoin Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers a unique opportunity to contribute to the...Full timeInternshipLocal areaImmediate startShift work$248.4k - $350.69k
...customers worldwide. Our Manufacturing Development and Customer Engineering (MDCE) organization is at the... ...Key Responsibilities: Leads a team of module development engineers to drive technology... ...as logic technology development, packaging, silicon process technologies, or related...Full timeInternshipLocal areaImmediate startWorldwideShift work$85.2k - $139.81k
...support root cause determination of assembled package yield loss and in-line failures on a back of week compressed shift. The engineer on shift will be responsible for technical... ..., as well as shift 1 engineers and module partners, yield support, integration and program...Full timeLocal areaImmediate startShift workAfternoon shift$120.86k - $170.63k
...of technology with innovative solutions. As a Strategic/Development Industrial Engineer within the Foundry Capacity Optimization (FCO) organization... ...of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of...Full timeLocal areaImmediate startShift work$155.52k - $298.44k
...Description: Join Intel and build a better tomorrow.Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel... ...of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of...Full timeLocal areaImmediate startShift work- ...Project Development Engineer (P2)LRE (Leeward Renewable Energy) is forging an American energy future with integrity, innovation, and positive... ...and performance team to stay current on wind turbine, solar module, solar inverter, and energy storage technology, offerings, and...Full timeContract workFor contractorsWork at officeLocal areaRemote work2 days per week3 days per week
- Intel Corporation's Advance Packaging Team in Phoenix is hiring a Manufacturing Technician within the Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTDSWA) organization. You will operate and maintain semiconductor manufacturing equipment, collect...Night shift
$80.9k - $117.1k
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...interconnects, patterning, packaging, heterogeneous integration,... ...partnering closely with technology development, manufacturing, and external... ..., process integration engineers, modeling experts, design, and... ...trade-off analysis, process module evaluation, design rule...Full timeLocal areaImmediate startShift work$48.51k - $66.7k
...solar wafers, and innovative photovoltaic modules, leveraging our leadership in advanced... ...elevate trends or anomalies to supervisors or engineers as needed Follow standardized work... ...shapes a life. Corning offers you the total package. Your well-being is our priority. Our...Full timeInternshipWork at officeWeekend work$140k - $192.5k
...Materials is a global leader in materials engineering solutions used to produce virtually... ...impact on the business . Contributes to the development of functional strategy. Leads project... ...addition to a comprehensive benefits package, candidates may be eligible for other forms...Full time$120k - $160k
Job Title Technical Business Development Engineer Reporting To Management, Engineering Sales & Post-Sale Consulting Work Schedule Onsite -... ...) listed is just one component of Moog's total compensation package for employees. Other rewards may include annual bonuses, employee...Work experience placement$60.45k - $85.34k
...Description: Become a part of Intel's Advance Packaging Team by joining the Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTDSWA)... ...maintain system reliability. Work closely with Module Engineering to execute experiments, implement equipment...Hourly payPart timeInternshipLocal areaImmediate startShift work3 days per week$145k - $160k
...Description Senior Project Manager (Land Development) Location: Phoenix, AZ Work... ...Organization Our client is a leading engineering and consulting firm specializing in innovative... ...offers a competitive compensation package including: ~ Medical, dental, and vision...Full timeWork at officeRelocation$105.65k - $149.15k
Job Details:Job Description: As a Silicon Packaging Design Engineer, you will play a pivotal role in driving the development of advanced substrate designs, contributing to the creation of cutting-edge technology that fuels Intel's innovation. You will be responsible for...Full timeInternshipLocal areaImmediate startShift work$133.8k - $188.89k
...Laboratory is seeking a motivated, hands-on engineer to join our Environmental Stress Tool... ...in advancing Intel's next-generation packaging technologies, including EMIB, Foveros,... ...supporting package qualification and technology development efforts. Our team develops, operates,...Full timeLocal areaImmediate startShift work
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