ASIC Package Design Manager (Fort Collins)

Please Note:1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)2. If you already have a Candidate Account, please Sign-In before you apply.Job Description:Broadcom is seeking an experienced IC Package Design Manager to lead a team of engineers designing complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power-delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 448G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. In this role, you will support and develop the engineering team, as well as contribute to technical methodologies and project management.RESPONSIBILITIES:Understand the skill sets and traits of each team member, in order to maximize productivity and retentionProject Management : Create and track project plans for 20+ concurrent designs (scope, schedules, resources)Organize team & customer activities to keep projects on trackCommunicate plans, status, next steps and risksCreate technical methodologies for package designSteering package technology and design rules, with input from team membersCustomer, vendor, & cross-functional collaboration EDUCATION/EXPERIENCE & REQUIREMENTS:Preferred candidates have previous experience managing people and projectsBSEE/MSEE or similar field and 12+ years of experience in flip-chip-BGA package design, including high-speed SerDes, with a minimum of 3 years in managementKnowledge of package-level signal integrity and power integrity, to apply to package designsCooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designersSelf-management and organization skillsTechnical understanding related to package design:Package-Design lifecycleHow the substrate and package fit into the overall ASIC design and manufacturing flowsDesign Data, including how it is created and used: .mcm, package spreadsheet, drawings (POD, Lid, Substrate)DFx trade offs (Design for “x”, where is x is manufacturability, reliability, assurance of supply, SI/PI, etc)Layout SI/PI extractions and SimulationsAutomation code development Mechanical & Thermal modelingProject ManagementNew Business QuotesOTHER REQUIREMENTSThis job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work positionOccasional travel may be requiredCompensation and BenefitsThe annual base salary range for this position is USD 143,800.00 To USD 230,000.00As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.SummaryLocation: USA-Colorado-Fort Collins-4380 Ziegler RoadType: Full time