Packaging Engineer

Packaging EngineerWe are seeking a Packaging Engineer to lead end-to-end packaging development for advanced microelectronic and RF communication products. This role is responsible for planning, designing, and delivering innovative packaging solutions across a range of technologies, including integrated circuits (ICs), system-in-package (SiP), sub-assemblies, and modules.You will own the full packaging lifecycle—from concept and definition through design, modeling, testing, and production release—while partnering closely with cross-functional engineering teams and external vendors. This position requires deep technical expertise in semiconductor packaging, strong problem-solving skills, and the ability to drive development in a fast-paced, high-reliability environment.ResponsibilitiesCollaborate with product development teams (RFIC, MMIC, and module engineering) to design and deliver next-generation packaging solutions for RF communication systemsDefine package architectures, materials, and processes that meet performance, reliability, manufacturability, and cost requirementsLead packaging efforts for new product introductions (NPI) and new technology developmentDevelop and manage packaging documentation, including statements of work (SOWs), drawings, and process flowsDesign and layout semiconductor packages such as QFN, SiP, WL-CSP, RDL, Flip Chip, FO-WLP, and interposersUtilize modeling and simulation (thermal, mechanical, electrical) to ensure early-stage design successProvide technical oversight to external vendors and manufacturing partners throughout package fabricationApply expertise in assembly processes (die attach, wirebond, bumping, overmolding) to guide design decisions and troubleshoot issuesEvaluate and recommend packaging solutions through feasibility studies for new productsPartner with engineering teams to optimize packaging for cost and performanceDefine and oversee reliability testing to ensure product robustness and complianceCoordinate cross-functional efforts across design, test, quality, manufacturing, and supply chain teamsIdentify and resolve material and process challenges during developmentManage packaging projects using industry-standard tools and methodologiesContribute to long-term packaging technology roadmaps and support proposal effortsQualifications10+ years of experience in semiconductor packaging, including package engineering, assembly processes, and reliabilityBachelor's degree in Electrical, Mechanical, Materials Engineering, or a related technical fieldStrong understanding of microelectronic packaging, including mechanical, electrical, and thermal performance considerationsSolid foundation in heat transfer and material propertiesExperience supporting RFIC, millimeter wave, SiP, or module-based productsHands-on experience with package design technologies such as QFN, SiP, BGA, WL-CSP, Flip Chip, bumping, or FO-WLPKnowledge of semiconductor assembly processes, including die prep, die attach, wirebonding, flip chip, and SMTFamiliarity with interconnect reliability testing (e.g., daisy chain, CPI, BLR)Understanding of metallization schemes for laminates, interposers, and SMTExperience with statistical analysis and design of experiments (DOE)Ability to operate independently and drive technical decisions in ambiguous environmentsStrong communication and collaboration skills across cross-functional teamsExperience translating system or IC requirements into packaging solutionsAdditional RequirementsU.S. Citizenship requiredAbility to travel up to 10%