Sr. Principal Metrology Engineer

Our client, a fast-growing advanced technology manufacturing company, is developing next-generation engineered materials used in high-performance computing, power electronics, wireless communications, and other advanced technology applications. The company is currently expanding its manufacturing operations and scaling highly advanced production technologies. They are seeking an experienced metrology and characterization engineer with strong analytical and problem‑solving skills to help drive measurement strategy, process understanding, and quality improvement across advanced materials and wafer‑based manufacturing operations. A successful candidate will likely have prior experience within semiconductor, advanced materials, wafer processing, or related high‑precision manufacturing environments.

RESPONSIBILITIES

Develop, optimize, and validate advanced metrology and characterization methodologies used across materials development and wafer processing operations Support surface, structural, optical, and wafer‑level characterization activities used to monitor process performance, material quality, and manufacturing consistency Develop and refine metrology recipes, calibration procedures, qualification methods, and measurement standards to improve repeatability and accuracy Work closely with process engineering, manufacturing, and R&D teams to correlate characterization data with process variation, yield trends, and overall device performance Implement statistical process control (SPC) methodologies and data analysis techniques to support process monitoring and continuous improvement initiatives Support failure analysis and root‐cause investigations related to process excursions, material defects, or measurement inconsistencies Interface with equipment vendors and internal engineering teams to improve metrology capability, throughput, automation, and integration into manufacturing workflows Develop automated analysis tools, scripts, and reporting solutions to improve measurement efficiency and data visibility Support characterization activities associated with backend wafer processing steps such as polishing, thinning, cleaning, singulation, bonding, or related operations

REQUIRED QUALIFICATIONS

MS or PhD in Materials Science, Physics, Electrical Engineering, Applied Physics, or related technical field 5+ years of relevant industry experience for PhD candidates or 8+ years for MS candidates within semiconductor, advanced materials, metrology, characterization, or related industries Hands‑on experience with advanced characterization and metrology equipment such as AFM, SEM, optical inspection systems, interferometry‑based measurement tools, wafer characterization platforms, or related instrumentation Experience supporting tool qualification, calibration, maintenance, recipe development, and process integration activities Strong analytical background with experience using statistical analysis tools and software environments such as JMP, Python, MATLAB, or similar platforms Familiarity with SPC methodologies and data‑driven manufacturing process improvement Excellent troubleshooting, communication, and cross‑functional collaboration skills Experience with thermal, optical, or electrical characterization techniques Familiarity with semiconductor backend processing operations such as CMP, wafer thinning, dicing, cleaning, or bonding Experience supporting manufacturing, pilot‑line, or production‑scale engineering environments Background developing automated metrology analysis or reporting infrastructure

INCENTIVES & BENEFITS

Base salary up to $195K Equity participation opportunity Annual performance bonus Medical, dental, vision, life, and disability insurance Flexible spending accounts and retirement savings plans PTO and paid holidays #J-18808-Ljbffr Gyga Force