Thermo-Mechanical CFD Intern: CoWoS IC Packaging
Etched.ai, Inc.
Etched.ai, Inc. is seeking a Thermo-Mechanical, CFD Simulation Engineering Intern to join the Advanced IC Packaging Team in San Jose, CA. This 12-week paid internship involves developing FEA models, performing critical analysis, and ensuring reliability of semiconductor packages. The right candidate will be pursuing a degree in Mechanical Engineering, with skills in ANSYS and SOLIDWORKS, and a passion for advancing high-performance computing systems. Generous housing support and daily meals are provided, along with mentorship from top industry experts. Apply now to make a meaningful impact! #J-18808-Ljbffr Etched.ai, Inc.
Vacancy posted 2 days ago
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