Advanced Packaging Architect

General InformationJob TitleAdvanced Packaging ArchitectJob ID18345CityAustinState/ProvinceTexasDate Posted06-Aug-2026Job CategoryEngineeringJob SubcategoryR&D EngineeringHire TypeEmployeeRemote EligibleNoBase Salary Range: $181000 - $271000Descriptions & RequirementsJob Description and RequirementsArchitect R&D Engineer, Advanced PackagingWe AreSynopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.You AreYou have built a career at the intersection of package substrate design and EDA tool development, and you understand that advancing the field requires more than incremental feature improvements. It requires rethinking the underlying technical approach. You are the engineer who can engage in substantive technical discussions with foundry partners and assembly and test companies about DRC constraints, PDN topology, and Design Rule Manual implementation, translating those conversations into actionable R&D direction.Your experience spans both the theoretical and the practical. You have developed EDA tools that handle production-scale designs, and you understand computational geometry well enough to anticipate when an algorithm will scale and when it will encounter limitations. You have worked through the details of ODB++ output formats and manufacturing handoff requirements because you know that tools must integrate seamlessly into real-world flows.At this stage in your career, you contribute to technical strategy while maintaining deep hands-on involvement in implementation. You guide less experienced engineers through complex technical decisions, helping them develop the judgment that comes from years of solving hard problems. At Synopsys, you will work on package substrate technology that enables the next generation of semiconductor products, and your technical contributions will influence how the industry approaches these design challenges.What You'll Be DoingLead R&D projects that advance the state of the art in package substrate design automation, including auto-routing algorithms, DRC verification engines, power delivery network analysis, and design-for-manufacturing capabilitiesDrive technical direction for database models that enable schematic-driven layout workflows and support integration across the Synopsys packaging tool suiteDevelop and optimize EDA software using C++, Python, and TCL to address complex challenges in computational geometry, constraint solving, and physical design automationCollaborate directly with foundries and assembly and test companies to implement emerging substrate technologies, translating their Design Rule Manuals and manufacturing requirements into functional toolingWork with cross-functional teams to define collateral input/output formats, integrate analysis capabilities, and ensure database architectures support increasingly complex designsProvide technical guidance to engineers across the R&D organization, reviewing designs and implementations, and helping the team navigate technical tradeoffsEngage with customers in technical discussions at senior levels, representing Synopsys expertise in substrate design methodology and contributing to product directionThe Impact You Will HaveEstablish technical foundations for next-generation package substrate design tools that will be adopted across the semiconductor industryEnable customers to design substrates for advanced packaging technologies that current tooling cannot adequately supportReduce design cycle time by delivering automation that accurately models the constraints substrate engineers face in production environmentsInfluence product roadmap by translating customer requirements and foundry technology trends into prioritized R&D initiativesAccelerate adoption of new packaging technologies by developing tools that integrate effectively with manufacturing flows and identify design-for-manufacturing issues earlyShape industry best practices by collaborating with foundries and OSATs to develop and validate new design methodologiesStrengthen the technical capabilities of the R&D organization through mentorship and knowledge transferWhat You'll NeedBachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or equivalent experience in EDA or semiconductor design10+ years of experience in EDA software development with focus on physical design automation, package design, or substrate designDeep technical expertise in package substrate physical design methodologies, including schematic-driven layout, auto-routing, design rule checking, and power delivery network analysisStrong programming proficiency in Python or TCL for tool integration and automationDemonstrated track record leading R&D projects that resulted in production software capabilities or significant architectural improvementsExperience collaborating with foundries, OSATs, or substrate manufacturers on Design Rule Manuals, technology files, and manufacturing output formats such as ODB++Solid foundation in computational geometry and algorithm design for layout automation, experience with constraint-based routing or placement is highly valuedWho You AreYou can engage in technical discussions with senior engineering leaders at semiconductor companies and clearly articulate complex technical tradeoffs and solution approachesYou raise concerns when technical requirements conflict with sound architectural principles, and you can articulate alternative approaches that address the underlying needYou write well-structured code with attention to maintainability, documentation, and long-term supportabilityYou are effective working in environments where requirements are still evolving, particularly when new packaging technologies are under development and design rules are not yet finalizedYou understand how to guide less experienced engineers through technical challenges in a way that builds their capabilities and judgmentYou approach partnerships with foundries and OSATs as collaborative technical relationships, recognizing that effective solutions require understanding their constraints and processesThe Team You'll Be Part OfYour recruiter will share more about the team structure and mission during the interview process.Rewards and BenefitsWe offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process.#LI-MK1At Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.In addition to the base salary, this role may be eligible for an annual bonus, equity, and other discretionary bonuses. Synopsys offers comprehensive health, wellness, and financial benefits as part of a competitive total rewards package. The actual compensation offered will be based on a number of job-related factors, including location, skills, experience, and education. Your recruiter can share more specific details on the total rewards package upon request. The base salary range for this role is across the U.S.