IC Packaging Design Engineer - Mentor Xpedition Specialist
Canvendor
Canvendor seeks an IC Packaging Design Engineer to work onsite in Chandler, AZ (and Hillsboro, OR as needed) on a 12+ month engagement. The candidate will hold a Bachelor's or Master’s degree in Electrical/Electronics Engineering and bring hands-on experience with Siemens Mentor Xpedition or Cadence Allegro/APD. Focus areas include physical design, substrate integration, and ensuring performance, manufacturability and reliability. #J-18808-Ljbffr Canvendor
Vacancy posted 1 day ago
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