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Hybrid SoC Physical Design Lead

$174k - $352.5k

Hewlett Packard Enterprise

A leading technology firm is seeking a SoC Top-Level & block-level Physical Design Engineer to implement large chip designs from RTL to GDSII. The role includes collaborating with IP vendors, optimizing timing and power constraints, and conducting physical design verification. You should have a background in electrical engineering with significant experience in large SoC designs. This hybrid role allows for flexible work arrangements, with an expected salary range of $174,000 - $352,500 annually. #J-18808-Ljbffr Hewlett Packard Enterprise

Vacancy posted 4 days ago
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