Process Integration Development Manager - Advanced Packaging

Job Description

Location :Remote – United States  

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Compensation : $190,000–$250,000 base salary + Equity & Bonus

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We are hiring Director, Process Integration & Development , an innovative technology company working at the forefront of advanced semiconductor packaging and heterogeneous integration .

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This is an exciting opportunity for a senior semiconductor professional to join a founding technical team, lead critical process development initiatives, and contribute to next-generation technologies supporting AI and high-performance computing.

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About the Role:

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The successful candidate will lead advanced packaging process integration and development while remaining hands-on with laboratory work, process optimization, and technical problem-solving.

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Key Responsibilities:

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• Lead semiconductor packaging process integration and development.
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• Drive process development across **patterning, bonding, and CMP**.
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• Solve complex integration challenges independently, from investigation through validation.
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• Build and lead technical teams while maintaining hands-on process ownership.
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• Support technology validation, manufacturing readiness, and yield improvement.
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• Collaborate with technical partners, equipment suppliers, and research teams.
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What We're Looking For:

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• Typically 8+ years of relevant semiconductor experience.
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• Strong hands-on expertise in advanced packaging, process integration, and development.
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• Direct experience with patterning, bonding technologies, and CMP.
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• Proven technical leadership with a hands-on approach.
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• Experience in hybrid bonding, chiplets, 2.5D/3D integration, or related technologies is an advantage.
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• Existing U.S. work authorization is required.
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• Ability to undertake 50%+ international travel, including potential extended stays abroad.
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Education:

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A master's or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, or a related field is listed in the original job description.

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Why Consider This Opportunity?

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• Join a founding technical team.
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• Help develop innovative semiconductor packaging technologies.
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• Combine strategic leadership with hands-on engineering.
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• Receive a competitive base salary alongside equity and bonus opportunities.
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Interested or know someone who could be a great fit? Apply directly or send a message to learn more.

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